Krishnan; Mahadevaiyer

Patent Applications and Registrations

Patent applications and USPTO patent grants for Krishnan; Mahadevaiyer.The latest application filed is for "chemical mechanical planarization slurries and processes for platinum group metals".

Company Profile

5.61.53

Krishnan; Mahadevaiyer - Hopewell Junction NY
Krishnan; Mahadevaiyer - Hopewll Junction NY
Krishnan; Mahadevaiyer - Hopewell Juncion NY
Krishnan, Mahadevaiyer - Hopewell NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical Mechanical Planarization Slurries And Processes For Platinum Group Metals App 20220277964 - Krishnan; Mahadevaiyer ; et al.	2022-09-01
Fabrication Of All-solid-state Energy Storage Devices App 20210280916 - COLLINS; John ; et al.	2021-09-09
Fabrication of all-solid-state energy storage devices Grant 11,031,631 - Collins , et al. June 8, 2	2021-06-08
Through silicon via energy storage devices Grant 10,833,301 - Collins , et al. November 10, 2	2020-11-10
Fabrication Of All-solid-state Energy Storage Devices App 20200212491 - COLLINS; John ; et al.	2020-07-02
Through Silicon Via Energy Storage Devices App 20200212383 - COLLINS; John ; et al.	2020-07-02
Indium phosphide smoothing and chemical mechanical planarization processes Grant 10,262,866 - Beveridge , et al.	2019-04-16
Indium Phosphide Smoothing And Chemical Mechanical Planarization Processes App 20180166292 - Beveridge; Henry A. ; et al.	2018-06-14
Indium phosphide smoothing and chemical mechanical planarization processes Grant 9,916,985 - Beveridge , et al. March 13, 2	2018-03-13
Germanium smoothing and chemical mechanical planarization processes Grant 9,890,300 - Kawamoto , et al. February 13, 2	2018-02-13
Protective insulating layer and chemical mechanical polishing for polycrystalline thin film solar cells Grant 9,741,890 - Gershon , et al. August 22, 2	2017-08-22
Germanium Smoothing And Chemical Mechanical Planarization Processes App 20170218229 - Kawamoto; Tatsuyoshi ; et al.	2017-08-03
Germanium smoothing and chemical mechanical planarization processes Grant 9,646,842 - Kawamoto , et al. May 9, 2	2017-05-09
Group III arsenide material smoothing and chemical mechanical planarization processes Grant 9,646,841 - Beveridge , et al. May 9, 2	2017-05-09
Group Iii Arsenide Material Smoothing And Chemical Mechanical Planarization Processes App 20170110333 - Beveridge; Henry A. ; et al.	2017-04-20
Germanium Smoothing And Chemical Mechanical Planarization Processes App 20170110334 - Kawamoto; Tatsuyoshi ; et al.	2017-04-20
Indium Phosphide Smoothing And Chemical Mechanical Planarization Processes App 20170110332 - Beveridge; Henry A. ; et al.	2017-04-20
Protective insulating layer and chemical mechanical polishing for polycrystalline thin film solar cells Grant 8,889,466 - Gershon , et al. November 18, 2	2014-11-18
Implantless dopant segregation for silicide contacts Grant 8,889,537 - Cabral, Jr. , et al. November 18, 2	2014-11-18
Silicon surface texturing method for reducing surface reflectance Grant 8,865,017 - Krishnan , et al. October 21, 2	2014-10-21
Protective Insulating Layer And Chemical Mechanical Polishing For Polycrystalline Thin Film Solar Cells App 20140305499 - Gershon; Talia S. ; et al.	2014-10-16
Protective Insulating Layer And Chemical Mechanical Polishing For Polycrystalline Thin Film Solar Cells App 20140306306 - Gershon; Talia S. ; et al.	2014-10-16
Reticle carrier Grant 8,815,475 - Petrarca , et al. August 26, 2	2014-08-26
Silicon Surface Texturing Method For Reducing Surface Reflectance App 20140051201 - Krishnan; Mahadevaiyer ; et al.	2014-02-20
Silicon Surface Texturing Method For Reducing Surface Reflectance App 20140042360 - Krishnan; Mahadevaiyer ; et al.	2014-02-13
Silicon surface texturing method for reducing surface reflectance Grant 8,637,405 - Krishnan , et al. January 28, 2	2014-01-28
Multi-spindle Chemical Mechanical Planarization Tool App 20130316623 - Cobb; Michael A. ; et al.	2013-11-28
Multi-spindle chemical mechanical planarization tool Grant 8,591,289 - Cobb , et al. November 26, 2	2013-11-26
Multi-spindle chemical mechanical planarization tool Grant 8,535,118 - Cobb , et al. September 17, 2	2013-09-17
Chemical mechanical planarization with overburden mask Grant 8,524,606 - Charns , et al. September 3, 2	2013-09-03
Chemical mechanical planarization processes for fabrication of FinFET devices Grant 8,513,127 - Chang , et al. August 20, 2	2013-08-20
Fabrication of replacement metal gate devices Grant 8,507,383 - Ando , et al. August 13, 2	2013-08-13
Shallow trench isolation chemical mechanical planarization Grant 8,497,210 - Charns , et al. July 30, 2	2013-07-30
Reticle Carrier App 20130130162 - Petrarca; Kevin S. ; et al.	2013-05-23
Reticle carrier Grant 8,439,728 - Petrarca , et al. May 14, 2	2013-05-14
Multi-spindle Chemical Mechanical Planarization Tool App 20130072092 - Lofaro; Michael F. ; et al.	2013-03-21
Multi-spindle Chemical Mechanical Planarization Tool App 20130072089 - Lofaro; Michael F. ; et al.	2013-03-21
Silicon Surface Texturing Method For Reducing Surface Reflectance App 20120329200 - Krishnan; Mahadevaiyer ; et al.	2012-12-27
Shallow Trench Isolation Chemical Mechanical Planarization App 20120083122 - Charns; Leslie ; et al.	2012-04-05
Chemical Mechanical Planarization Processes For Fabrication of FINFET Devices App 20120083123 - Chang; Josephine B. ; et al.	2012-04-05
Chemical Mechanical Planarization With Overburden Mask App 20120083125 - Charns; Leslie ; et al.	2012-04-05
Fabrication of Replacement Metal Gate Devices App 20120083121 - Ando; Takashi ; et al.	2012-04-05
Damascene Reticle And Method Of Manufacture Thereof App 20120040277 - Petrarca; Kevin S. ; et al.	2012-02-16
Method of manufacture of damascene reticle Grant 8,110,321 - Petrarca , et al. February 7, 2	2012-02-07
Method and process for forming a self-aligned silicide contact Grant 8,101,518 - Cabral, Jr. , et al. January 24, 2	2012-01-24
Implantless Dopant Segregation for Silicide Contacts App 20120009771 - Cabral, JR.; Cyril ; et al.	2012-01-12
Method for forming self-aligned metal silicide contacts Grant 8,039,382 - Fang , et al. October 18, 2	2011-10-18
Method And Composition For Electro-chemical-mechanical Polishing App 20100051474 - Andricacos; Panayotis C. ; et al.	2010-03-04
Method For Forming Self-aligned Metal Silicide Contacts App 20090309228 - Fang; Sunfei ; et al.	2009-12-17
Method for forming self-aligned metal silicide contacts Grant 7,618,891 - Fang , et al. November 17, 2	2009-11-17
Method of forming noble metal contacts Grant 7,581,314 - Deligianni , et al. September 1, 2	2009-09-01
Method and process for forming a self-aligned silicide contact Grant 7,544,610 - Cabral, Jr. , et al. June 9, 2	2009-06-09
Interconnect Structure And Method Of Making Same App 20090127711 - Bonilla; Griselda ; et al.	2009-05-21
Damascene Reticle And Method Of Manufacture Thereof App 20080286660 - Petrarca; Kevin S. ; et al.	2008-11-20
Method And Process For Forming A Self-aligned Silicide Contact App 20080274611 - Cabral; Cyril ; et al.	2008-11-06
Manufacturable CoWP metal cap process for copper interconnects Grant 7,407,605 - Restaino , et al. August 5, 2	2008-08-05
Homogeneous Copper Interconnects for BEOL App 20080156636 - Petrarca; Kevin S. ; et al.	2008-07-03
Method for forming self-aligned metal silicide contacts App 20070254479 - Fang; Sunfei ; et al.	2007-11-01
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20070215842 - Restaino; Darryl D. ; et al.	2007-09-20
Manufacturable CoWP metal cap process for copper interconnects Grant 7,253,106 - Restaino , et al. August 7, 2	2007-08-07
Noble metal contacts for micro-electromechanical switches Grant 7,202,764 - Deligianni , et al. April 10, 2	2007-04-10
Selective capping of copper wiring Grant 7,190,079 - Andricacos , et al. March 13, 2	2007-03-13
Noble metal contacts for micro-electromechanical switches App 20060164194 - Deligianni; Hariklia ; et al.	2006-07-27
Method and composition for electro-chemical-mechanical polishing App 20060163083 - Andricacos; Panayotis C. ; et al.	2006-07-27
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20060134911 - Restaino; Darryl D. ; et al.	2006-06-22
Copper recess process with application to selective capping and electroless plating Grant 7,064,064 - Chen , et al. June 20, 2	2006-06-20
Very low effective dielectric constant interconnect structures and methods for fabricating the same Grant 7,045,453 - Canaperi , et al. May 16, 2	2006-05-16
Selective capping of copper wiring App 20060076685 - Andricacos; Panayotis C. ; et al.	2006-04-13
Homogeneous Copper Interconnects for BEOL App 20060071338 - Petrarca; Kevin S. ; et al.	2006-04-06
Very low effective dielectric constant interconnect Structures and methods for fabricating the same Grant 7,023,093 - Canaperi , et al. April 4, 2	2006-04-04
Method and process for forming a self-aligned silicide contact App 20060051961 - Cabral; Cyril JR. ; et al.	2006-03-09
Selective capping of copper wiring Grant 7,008,871 - Andricacos , et al. March 7, 2	2006-03-07
Copper recess process with application to selective capping and electroless plating Grant 6,975,032 - Chen , et al. December 13, 2	2005-12-13
Very low effective dielectric constant interconnect structures and methods for fabricating the same App 20050186778 - Canaperi, Donald F. ; et al.	2005-08-25
Copper recess process with application to selective capping and electroless plating App 20050158985 - Chen, Shyng-Tsong ; et al.	2005-07-21
Noble Metal Contacts For Micro-electromechanical Switches App 20050007217 - Deligianni, Hariklia ; et al.	2005-01-13
Selective capping of copper wiring App 20050001325 - Andricacos, Panayotis C. ; et al.	2005-01-06
Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate Grant 6,825,075 - Petrarca , et al. November 30, 2	2004-11-30
Slurry for mechanical polishing (CMP) of metals and use thereof Grant 6,812,193 - Brigham , et al. November 2, 2	2004-11-02
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same App 20040147089 - Petrarca, Kevin S. ; et al.	2004-07-29
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Grant 6,756,624 - Petrarca , et al. June 29, 2	2004-06-29
Copper recess process with application to selective capping and electroless plating App 20040113279 - Chen, Shyng-Tsong ; et al.	2004-06-17
Bilayer CMP process to improve surface roughness of magnetic stack in MRAM technology Grant 6,743,642 - Costrini , et al. June 1, 2	2004-06-01
Method of forming planar Cu interconnects without chemical mechanical polishing App 20040094511 - Seo, Soon-Cheon ; et al.	2004-05-20
Bilayer Cmp Process To Improve Surface Roughness Of Magnetic Stack In Mram Technology App 20040087038 - Costrini, Gregory ; et al.	2004-05-06
Very low effective dielectric constant interconnect Structures and methods for fabricating the same App 20040087135 - Canaperi, Donald F. ; et al.	2004-05-06
Method for fabricating a scanning probe microscope probe Grant 6,656,369 - Krishnan , et al. December 2, 2	2003-12-02
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same App 20030211698 - Petrarca, Kevin S. ; et al.	2003-11-13
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Grant 6,597,068 - Petrarca , et al. July 22, 2	2003-07-22
Method for fabricating a scanning probe microscope probe App 20030132191 - Krishnan, Mahadevaiyer ; et al.	2003-07-17
Slurry for mechanical polishing (CMP) of metals and use thereof App 20030073593 - Brigham, Michael Todd ; et al.	2003-04-17
Process to increase reliability CuBEOL structures Grant 6,503,834 - Chen , et al. January 7, 2	2003-01-07
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same App 20020068431 - Petrarca, Kevin S. ; et al.	2002-06-06
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Grant 6,368,953 - Petrarca , et al. April 9, 2	2002-04-09
Method of forming barrier layers for damascene interconnects Grant 6,358,832 - Edelstein , et al. March 19, 2	2002-03-19
Slurry for mechanical polishing (CMP) of metals and use thereof Grant 6,348,076 - Canaperi , et al. February 19, 2	2002-02-19
pH-buffered slurry and use thereof for polishing Grant 6,190,237 - Huynh , et al. February 20, 2	2001-02-20
Dual etch stop/diffusion barrier for damascene interconnects Grant 6,153,935 - Edelstein , et al. November 28, 2	2000-11-28
Chemical mechanical polishing of multiple material substrates and slurry having improved selectivity Grant 6,114,249 - Canaperi , et al. September 5, 2	2000-09-05
Inductive head lamination with layer of magnetic quenching material Grant 5,576,099 - Canaperi , et al. * November 19, 1	1996-11-19
Tetra aza ligand systems as complexing agents for electroless deposition of copper Grant 5,102,456 - Jagannathan , et al. April 7, 1	1992-04-07
Tetra aza ligand systems as complexing agents for electroless deposition of copper Grant 5,059,243 - Jagannathan , et al. October 22, 1	1991-10-22
Electroless copper plating bath Grant 4,818,286 - Jagannathan , et al. April 4, 1	1989-04-04