Krawczyk; John William
Patent Applications and Registrations
Patent applications and USPTO patent grants for Krawczyk; John William.The latest application filed is for "method and apparatus for maximizing cooling for wafer processing".
- Krawczyk; John William - Richmond KY
| Patent | Date |
|---|---|
| Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto Grant 7,766,455 - Graham , et al. August 3, 2 | 2010-08-03 |
| Method and Apparatus for Maximizing Cooling for Wafer Processing App 20080083700 - Bernard; David Laurier ; et al. | 2008-04-10 |
| Methods of Etching Polymeric Materials Suitable for Making Micro-Fluid Ejection Heads and Micro-Fluid Ejection Heads Relating Thereto App 20080007595 - Krawczyk; John William ; et al. | 2008-01-10 |
| Flexible Adhesive Materials for Micro-Fluid Ejection Heads and Methods Relating Thereto App 20070229594 - Graham; David Christopher ; et al. | 2007-10-04 |
| Micro-fluid ejection assemblies Grant 7,273,266 - Krawczyk , et al. September 25, 2 | 2007-09-25 |
| Micro-fluid ejection assemblies App 20050231557 - Krawczyk, John William ; et al. | 2005-10-20 |
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