Patent | Date |
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Method for manufacturing a MEMS unit for a micromechanical pressure sensor Grant 11,208,319 - Dannenberg , et al. December 28, 2 | 2021-12-28 |
Method for producing a stress-decoupled micromechanical pressure sensor Grant 10,988,377 - Dannenberg , et al. April 27, 2 | 2021-04-27 |
Method for manufacturing a semiconductor device and semiconductor device Grant 10,950,455 - Wu , et al. March 16, 2 | 2021-03-16 |
Method For Manufacturing A Semiconductor Device And Semiconductor Device App 20200090942 - Wu; Zhenyu ;   et al. | 2020-03-19 |
Method For Manufacturing A Mems Unit For A Micromechanical Pressure Sensor App 20200024133 - Dannenberg; Arne ;   et al. | 2020-01-23 |
Sensor element for thermal anemometry Grant 10,473,683 - Schoen , et al. Nov | 2019-11-12 |
Method For Producing A Stress-decoupled Micromechanical Pressure Sensor App 20190202687 - Dannenberg; Arne ;   et al. | 2019-07-04 |
Sensor unit including a decoupling structure and manufacturing method therefor Grant 9,926,188 - Classen , et al. March 27, 2 | 2018-03-27 |
Sensor Element For Thermal Anemometry App 20170299622 - Schoen; Florian ;   et al. | 2017-10-19 |
Sensor Unit Including A Decoupling Structure And Manufacturing Method Therefor App 20170203958 - CLASSEN; Johannes ;   et al. | 2017-07-20 |
Interposer For Mounting A Vertically Integrated Hybrid Component On A Component Carrier App 20170081177 - Neul; Reinhard ;   et al. | 2017-03-23 |
ASIC element, in particular as a component of a vertically integrated hybrid component Grant 9,475,693 - Meisel , et al. October 25, 2 | 2016-10-25 |
Asic Element, In Particular As A Component Of A Vertically Integrated Hybrid Component App 20150353343 - MEISEL; Daniel Christoph ;   et al. | 2015-12-10 |
Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure App 20150353345 - HEUCK; Friedjof ;   et al. | 2015-12-10 |
Method for producing a component, and sensor element Grant 8,530,261 - Kramer , et al. September 10, 2 | 2013-09-10 |
Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate Grant 8,519,494 - Kramer , et al. August 27, 2 | 2013-08-27 |
Method for manufacturing capped MEMS components Grant 8,470,631 - Kramer , et al. June 25, 2 | 2013-06-25 |
Method for producing a plurality of chips and a chip produced accordingly Grant 8,405,210 - Kramer , et al. March 26, 2 | 2013-03-26 |
Method for manufacturing chips Grant 8,389,327 - Kramer , et al. March 5, 2 | 2013-03-05 |
Method for manufacturing a micromechanical chip and a component having a chip of this type Grant 7,989,263 - Kramer , et al. August 2, 2 | 2011-08-02 |
Method for manufacturing a component, method for manufacturing a component system, component, and component system App 20110169107 - Kramer; Torsten ;   et al. | 2011-07-14 |
Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate App 20110147864 - Kramer; Torsten ;   et al. | 2011-06-23 |
Method For Manufacturing Chips App 20110151620 - Kramer; Torsten ;   et al. | 2011-06-23 |
Method For Producing A Plurality Of Chips And A Chip Produced Accordingly App 20100283147 - Kramer; Torsten ;   et al. | 2010-11-11 |
Method For Manufacturing Capped Mems Components App 20100267183 - Kramer; Torsten ;   et al. | 2010-10-21 |
Method For Producing A Component, And Sensor Element App 20100164027 - Kramer; Torsten ;   et al. | 2010-07-01 |
Method for manufacturing a micromechanical chip and a component having a chip of this type App 20100084722 - KRAMER; Torsten ;   et al. | 2010-04-08 |
Microcontroller and addressing method App 20060271762 - Kramer; Torsten | 2006-11-30 |
Data carrier Grant 6,827,278 - Timm , et al. December 7, 2 | 2004-12-07 |
Data carrier having reset means for interrupting the processing Grant 6,655,599 - Thueringer , et al. December 2, 2 | 2003-12-02 |
Data carrier having reset means for interrupting the processing App 20010052548 - Thueringer, Peter ;   et al. | 2001-12-20 |