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Patent applications and USPTO patent grants for Krajniak; Jan.The latest application filed is for "microelectronic structures including bridges".
Patent | Date |
---|---|
Microelectronic Structures Including Bridges App 20210391295 - Karhade; Omkar G. ;   et al. | 2021-12-16 |
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite App 20200273811 - Mallik; Debendra ;   et al. | 2020-08-27 |
Coupled Cooling Fins In Ultra-small Systems App 20200273772 - Uppal; Aastha ;   et al. | 2020-08-27 |
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction App 20200273768 - Karhade; Omkar ;   et al. | 2020-08-27 |
Thermal Management Solutions For Integrated Circuit Packages App 20200227332 - Singh; Kumar Abhishek ;   et al. | 2020-07-16 |
No-flow Adhesive For Second And Third Level Interconnects App 20180324955 - SOOD; Mohit ;   et al. | 2018-11-08 |
Energy Storage Material For Thermal Management And Associated Techniques And Configurations App 20180068926 - KRAJNIAK; JAN ;   et al. | 2018-03-08 |
Substrate On Substrate Package App 20170053858 - Krajniak; Jan ;   et al. | 2017-02-23 |
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