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Kozono; Hiroyuki Patent Filings

Kozono; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kozono; Hiroyuki.The latest application filed is for "three-dimensional semiconductor device having plural active semiconductor components".

Company Profile
0.11.2
  • Kozono; Hiroyuki - Kawasaki JP
  • Kozono, Hiroyuki - Kanagawa-ken JP
  • Kozono, Hiroyuki - Kawasaki-shi JP
  • Kozono; Hiroyuki - Yokohama JP
  • Kozono; Hiroyuki - Omiya JP
  • Kozono; Hiroyuki - Oomiya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate
Grant 6,608,387 - Kozono August 19, 2
2003-08-19
Three-dimensional semiconductor device having plural active semiconductor components
App 20030038366 - Kozono, Hiroyuki
2003-02-27
Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate
App 20020125560 - Kozono, Hiroyuki
2002-09-12
Resin-sealed semiconductor device
Grant 6,177,718 - Kozono January 23, 2
2001-01-23
Semiconductor device
Grant 6,107,689 - Kozono August 22, 2
2000-08-22
Resin sealed semiconductor device
Grant 5,910,681 - Kozono June 8, 1
1999-06-08
Resin-sealed semiconductor device
Grant 5,796,160 - Kozono August 18, 1
1998-08-18
Semiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chip
Grant 5,619,070 - Kozono April 8, 1
1997-04-08
Semiconductor device and its manufacturing method
Grant 5,581,123 - Kozono December 3, 1
1996-12-03
High frequency semiconductor device
Grant 5,532,514 - Kozono July 2, 1
1996-07-02
Semiconductor device having semiconductor chip with backside electrode
Grant 5,497,031 - Kozono March 5, 1
1996-03-05
Resin encapsulation type semiconductor device having an improved lead configuration
Grant 5,420,459 - Kozono May 30, 1
1995-05-30
Array type semiconductor device having insulating circuit board
Grant 5,399,904 - Kozono March 21, 1
1995-03-21

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