KOYAMA; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KOYAMA; Toshiyuki.The latest application filed is for "lactobacillus-containing chocolate and manufacturing method therefor".

Company Profile

1.7.10

KOYAMA; Toshiyuki - Saitama JP
KOYAMA; Toshiyuki - Saitama-shi Saitama
Koyama; Toshiyuki - Yamanashi JP
Koyama; Toshiyuki - Kanagawa N/A JP
Koyama; Toshiyuki - Anjo-shi JP
Koyama; Toshiyuki - Yamanashi-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lactobacillus-containing Chocolate And Manufacturing Method Therefor App 20190223464 - ASHITANI; Hiroaki ; et al.	2019-07-25
Lactic Acid Bacterium-containing Fat Or Oil Composition And Method For Manufacturing Same App 20180206540 - ASHITANI; Hiroaki ; et al.	2018-07-26
Method for mounting electronic component Grant 9,992,918 - Watanabe , et al. June 5, 2	2018-06-05
Apparatus for mounting electronic component Grant 9,867,320 - Watanabe , et al. January 9, 2	2018-01-09
Method of processing wheat flour, processed wheat flour obtained by the method and food utilizing the processed wheat flour Grant 9,185,916 - Ito , et al. November 17, 2	2015-11-17
Apparatus And Method For Mounting Electronic Component App 20150128411 - WATANABE; Hideaki ; et al.	2015-05-14
Apparatus And Method For Mounting Electronic Component App 20150128410 - WATANABE; Hideaki ; et al.	2015-05-14
Carbon Dioxide Gas Processing Apparatus And Carbon Dioxide Gas Processing Method App 20120189529 - Wakimoto; Yoshiki ; et al.	2012-07-26
Method Of Processing Wheat Flour, Processed Wheat Flour Obtained By The Method And Food Utilizing The Processed Wheat Flour App 20080095916 - Ito; Masanori ; et al.	2008-04-24
Wiring and piping apparatus of part mounting machine App 20060016614 - Yokoyama; Dai ; et al.	2006-01-26
Electronic component mounting apparatus Grant 6,915,561 - Yokoyama , et al. July 12, 2	2005-07-12
Apparatus for mounting a wire component Grant 6,715,205 - Watanabe , et al. April 6, 2	2004-04-06
Component mounting apparatus and device for detecting attachment on component substrate Grant 6,609,295 - Koyama , et al. August 26, 2	2003-08-26
Electronic component mounting apparatus App 20020108237 - Yokoyama, Dai ; et al.	2002-08-15
Reflow soldering apparatus and method App 20020060235 - Nagafuku, Nobuyasu ; et al.	2002-05-23
Apparatus and method for mounting wire component App 20020046463 - Watanabe, Hideaki ; et al.	2002-04-25

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