Koyama; Shigeki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koyama; Shigeki.The latest application filed is for "composite member, heat radiation member, semiconductor device, and method of manufacturing composite member".

Company Profile

1.7.6

Koyama; Shigeki - Toyama JP
KOYAMA; Shigeki - Toyama-shi Toyama
Koyama; Shigeki - Kobe-shi JP
Koyama; Shigeki - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member Grant 11,147,156 - Iwayama , et al. October 12, 2	2021-10-12
Composite Member, Heat Radiation Member, Semiconductor Device, And Method Of Manufacturing Composite Member App 20190297725 - IWAYAMA; Isao ; et al.	2019-09-26
Magnesium-based composite member, heat radiation member, and semiconductor device Grant 9,556,501 - Iwayama , et al. January 31, 2	2017-01-31
Composite member including substrate made of composite material Grant 9,347,120 - Iwayama , et al. May 24, 2	2016-05-24
Hydroponic Cultivation Kit App 20150327451 - Koyama; Shigeki	2015-11-19
Composite Member Including Substrate Made Of Composite Material App 20130328184 - Iwayama; Isao ; et al.	2013-12-12
Magnesium-based Composite Member, Heat Radiation Member, And Semiconductor Device App 20130009301 - Iwayama; Isao ; et al.	2013-01-10
Heat Spreader For Semiconductor Device And Method For Manufacturing The Same App 20100206537 - Ikeda; Toshiya ; et al.	2010-08-19
Figure processing method Grant 6,144,765 - Tamura , et al. November 7, 2	2000-11-07
Image processing method and apparatus Grant 5,739,827 - Nagano , et al. April 14, 1	1998-04-14

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