Koyama; Naoyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koyama; Naoyuki.The latest application filed is for "polishing agent and method for polishing substrate using the polishing agent".

Company Profile

2.21.21

Koyama; Naoyuki - Tsukuba JP
Koyama; Naoyuki - Tsukuba-shi JP
KOYAMA; Naoyuki - Ibaraki JP
Koyama; Naoyuki - Hitachi JP
- Tsukuba JP
Koyama; Naoyuki - Hitachi-shi JP
Koyama, Naoyuki - Ibaraki-ken JP
Koyama; Naoyuki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing agent and method for polishing substrate using the polishing agent Grant 10,040,971 - Hoshi , et al. August 7, 2	2018-08-07
Polishing Agent And Method For Polishing Substrate Using The Polishing Agent App 20150361303 - HOSHI; Yousuke ; et al.	2015-12-17
Polishing agent and method for polishing substrate using the polishing agent Grant 9,165,777 - Hoshi , et al. October 20, 2	2015-10-20
Resin Composition, Molded Body And Composite Molded Body App 20150135992 - KOBUNE; Mika ; et al.	2015-05-21
CMP polishing slurry and method of polishing substrate Grant 8,900,335 - Fukasawa , et al. December 2, 2	2014-12-02
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 8,900,477 - Uchida , et al. December 2, 2	2014-12-02
Polishing agent and method for polishing substrate using the polishing agent Grant 08617275 -	2013-12-31
Polishing agent and method for polishing substrate using the polishing agent Grant 8,617,275 - Hoshi , et al. December 31, 2	2013-12-31
Polishing Agent And Method For Polishing Substrate Using The Polishing Agent App 20130252426 - HOSHI; Yousuke ; et al.	2013-09-26
CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method Grant 8,524,111 - Fukasawa , et al. September 3, 2	2013-09-03
Resin Composition, Molded Body And Composite Molded Body App 20120302699 - Kobune; Mika ; et al.	2012-11-29
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 8,226,849 - Uchida , et al. July 24, 2	2012-07-24
CMP polishing slurry and polishing method Grant 8,168,541 - Fukasawa , et al. May 1, 2	2012-05-01
Polishing slurry and polishing method Grant 8,075,800 - Koyama , et al. December 13, 2	2011-12-13
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive Grant 8,002,860 - Koyama , et al. August 23, 2	2011-08-23
Polishing Agent And Method For Polishing Substrate Using The Polshing Agent App 20110039475 - Hoshi; Yousuke ; et al.	2011-02-17
Cmp Polishing Slurry And Polishing Method App 20110028073 - Fukasawa; Masato ; et al.	2011-02-03
CMP polishing compound and polishing method Grant 7,838,482 - Fukasawa , et al. November 23, 2	2010-11-23
CMP polishing slurry and polishing method Grant 7,837,800 - Fukasawa , et al. November 23, 2	2010-11-23
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 7,799,686 - Uchida , et al. September 21, 2	2010-09-21
Cmp Polishing Slurry And Method Of Polishing Substrate App 20100210109 - Fukasawa; Masato ; et al.	2010-08-19
Cmp Abrasive, Method For Polishing Substrate And Method For Manufacturing Semiconductor Device Using The Same, And Additive For Cmp Abrasive App 20090253355 - Koyama; Naoyuki ; et al.	2009-10-08
CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method App 20090047786 - Fukasawa; Masato ; et al.	2009-02-19
Cmp Polishing Slurry and Method of Polishing Substrate App 20080254717 - Fukasawa; Masato ; et al.	2008-10-16
CMP polishing slurry and polishing method App 20080214093 - Fukasawa; Masato ; et al.	2008-09-04
Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound Grant 7,410,409 - Koyama , et al. August 12, 2	2008-08-12
Materials For Polishing Liquid For Metal, Polishing Liquid For Metal, Method For Preparation Thereof And Polishing Method Using The Same App 20080121840 - Uchida; Takeshi ; et al.	2008-05-29
Cmp Polishing Slurry and Method of Polishing Substrate App 20080003925 - Fukasawa; Masato ; et al.	2008-01-03
Chemical Mechanical Polishing Slurry, Cmp Process And Electronic Device Process App 20070270085 - Ota; Ryo ; et al.	2007-11-22
Cmp Polishing Slurry And Method Of Polishing Substrate App 20070218811 - Kurata; Yasushi ; et al.	2007-09-20
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same Grant 7,250,369 - Uchida , et al. July 31, 2	2007-07-31
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive App 20070169421 - Koyama; Naoyuki ; et al.	2007-07-26
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same App 20070167017 - Uchida; Takeshi ; et al.	2007-07-19
Hazardous substance decomposer and process for producing the same App 20060289826 - Koyama; Naoyuki ; et al.	2006-12-28
Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same App 20060216939 - Uchida; Takeshi ; et al.	2006-09-28
Cmp polishing compound and polishing method App 20060148667 - Fukasawa; Masato ; et al.	2006-07-06
Polishing compound and method for polishing substrate Grant 6,786,945 - Machii , et al. September 7, 2	2004-09-07
Polishing compound and method for polishing substrate App 20040065022 - Machii, Youichi ; et al.	2004-04-08
Sign perception system, game system, and computer-readable recording medium having game program recorded thereon Grant 6,642,917 - Koyama , et al. November 4, 2	2003-11-04

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