Koyama; Masayoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koyama; Masayoshi.The latest application filed is for "semiconductor device and method for manufacturing the same".

Company Profile

0.16.15

Koyama; Masayoshi - Osaka N/A JP
Koyama; Masayoshi - Kanagawa JP
Koyama; Masayoshi - Kadoma JP
Koyama; Masayoshi - Tondabayashi JP
Koyama; Masayoshi - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same Grant 9,162,249 - Koyama , et al. October 20, 2	2015-10-20
Semiconductor device and method for manufacturing the same Grant 9,076,752 - Kojima , et al. July 7, 2	2015-07-07
Semiconductor Device And Method For Manufacturing The Same App 20140231981 - Kojima; Toshiyuki ; et al.	2014-08-21
Wiring board connection method Grant 8,353,102 - Koyama , et al. January 15, 2	2013-01-15
Method of joining electronic component and the electronic component Grant 8,304,338 - Tsukahara , et al. November 6, 2	2012-11-06
Circuit board and method for jointing circuit board Grant 8,115,109 - Koyama , et al. February 14, 2	2012-02-14
Head unit, droplet discharging apparatus, droplet discharging system, information processing apparatus, information processing method, status information notifying method, status information updating method, faulty position detecting method, and programs Grant 8,111,426 - Koyama , et al. February 7, 2	2012-02-07
Head unit, droplet discharging apparatus, droplet discharging system, information processing apparatus, information processing method, status information notifying method, status information updating method, faulty position detecting method, and programs Grant 8,081,345 - Koyama , et al. December 20, 2	2011-12-20
Bump forming method and bump forming apparatus Grant 7,905,011 - Taniguchi , et al. March 15, 2	2011-03-15
Head unit, droplet discharging apparatus, droplet discharging system, information processing apparatus, information processing method, status information notifying method, status information updating method, faulty position detecting method, and programs Grant 7,869,084 - Koyama , et al. January 11, 2	2011-01-11
Method Of Joining Electronic Component And The Electronic Component App 20100244283 - Tsukahara; Norihito ; et al.	2010-09-30
Plasma display panel cutting method Grant 7,753,752 - Kirihara , et al. July 13, 2	2010-07-13
Multilayer circuit board and manufacturing method thereof Grant 7,737,367 - Koyama , et al. June 15, 2	2010-06-15
Paste Applicator And Paste Application Method App 20100080912 - Koyama; Masayoshi ; et al.	2010-04-01
Circuit Board And Method For Jointing Circuit Board App 20090266592 - Koyama; Masayoshi ; et al.	2009-10-29
Bump Forming Method And Bump Forming Apparatus App 20090229120 - Taniguchi; Yasushi ; et al.	2009-09-17
Plasma Display Panel Cutting Method, Plasma Display Panel Recycling Method And Plasma Display Panel Cutting Apparatus App 20090156081 - Kirihara; Nobuyuki ; et al.	2009-06-18
Method for manufacturing component built-in module, and component built-in module Grant 7,488,895 - Hayashi , et al. February 10, 2	2009-02-10
Wiring Board Connection Method And Wiring Board App 20080283284 - KOYAMA; Masayoshi ; et al.	2008-11-20
Head Unit, Droplet Discharging Apparatus, Droplet Discharging System, Information Processing Apparatus, Information Processing Method, Status Information Notifying Method, Status Information Updating Method, Faulty Position Detecting Method, And Programs App 20080186340 - Koyama; Masayoshi ; et al.	2008-08-07
Head Unit, Droplet Discharging Apparatus, Droplet Discharging System, Information Processing Apparatus, Information Processing Method, Status Information Notifying Method, Status Information Updating Method, Faulty Position Detecting Method, And Programs App 20080068624 - Koyama; Masayoshi ; et al.	2008-03-20
Head Unit, Droplet Discharging Apparatus, Droplet Discharging System, Information Processing Apparatus, Information Processing Method, Status Information Notifying Method, Status Information Updating Method, Faulty Position Detecting App 20080062462 - Koyama; Masayoshi ; et al.	2008-03-13
Method for manufacturing component built-in module, and component built-in module App 20070119617 - Hayashi; Yoshitake ; et al.	2007-05-31
Multilayer circuit board and manufacturing method thereof App 20060191715 - Koyama; Masayoshi ; et al.	2006-08-31
Head unit, droplet discharging apparatus, droplet discharging system, information processing apparatus, information processing method, status information notifying method, status information updating method, faulty position detecting method, and programs App 20050146549 - Koyama, Masayoshi ; et al.	2005-07-07
Installing method, network apparatus, identification information communicating method, information processing apparatus, connection information acquiring method, connection information displaying method, recording medium, and program App 20050108705 - Koyama, Masayoshi	2005-05-19
Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body Grant 6,613,180 - Sunagawa , et al. September 2, 2	2003-09-02
Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body App 20030027371 - Sunagawa, Yoshitaka ; et al.	2003-02-06
Supporting metal fittings for double beams Grant 5,259,165 - Koyama November 9, 1	1993-11-09

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