KOYAMA; Kunihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for KOYAMA; Kunihiro.The latest application filed is for "method for mounting electronic-component module, method for manufacturing electronic apparatus using the same, and electronic-component module".
- KOYAMA; Kunihiro - Otsu-shi JP
- Koyama; Kunihiro - Otsu JP
- Koyama; Kunihiro - Shiga-ken JP
| Patent | Date |
|---|---|
| Method For Mounting Electronic-component Module, Method For Manufacturing Electronic Apparatus Using The Same, And Electronic-component Module App 20100085722 - KOYAMA; Kunihiro ; et al. | 2010-04-08 |
| High-frequency composite component Grant 7,653,360 - Uejima , et al. January 26, 2 | 2010-01-26 |
| Method for mounting electronic-component module Grant 7,650,692 - Koyama , et al. January 26, 2 | 2010-01-26 |
| High-frequency Composite Component App 20080315968 - UEJIMA; Takanori ; et al. | 2008-12-25 |
| Method For Mounting Electronic-component Module, Method For Manufacturing Electronic Apparatus Using The Same, And Electronic-component Module App 20080192447 - KOYAMA; Kunihiro ; et al. | 2008-08-14 |
| High frequency composite component Grant 7,398,059 - Uejima , et al. July 8, 2 | 2008-07-08 |
| High frequency composite component App 20070035362 - Uejima; Takanori ; et al. | 2007-02-15 |
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