Koyama; Keiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koyama; Keiji.The latest application filed is for "different-pitch flat cable connection structure, pitch-conversion flat cable, and method for producing pitch-conversion flat cable".

Company Profile

0.12.12

Koyama; Keiji - Chikuma N/A JP
Koyama; Keiji - Tochigi JP
KOYAMA; Keiji - Chikuma-shi JP
Koyama; Keiji - Osaka JP
Koyama; Keiji - Osaka-shi JP
Koyama; Keiji - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin molding machine Grant 9,738,014 - Maeyama , et al. August 22, 2	2017-08-22
Different-pitch flat cable connection structure, pitch-conversion flat cable, and method for producing pitch-conversion flat cable Grant 9,425,527 - Mikage , et al. August 23, 2	2016-08-23
Different-pitch Flat Cable Connection Structure, Pitch-conversion Flat Cable, And Method For Producing Pitch-conversion Flat Cable App 20150325937 - MIKAGE; Katsunari ; et al.	2015-11-12
Resin Molding Machine App 20120135096 - MAEYAMA; Tetsuya ; et al.	2012-05-31
Grain classifying device and adhesive containing grains classified by the device Grant 8,061,527 - Koyama , et al. November 22, 2	2011-11-22
Grain classifying device and adhesive containing grains classified by the device Grant 8,047,381 - Koyama , et al. November 1, 2	2011-11-01
Process for production of chain metal powders, chain metal powers produced thereby, and anisotropic conductive film formed by using the powders Grant 8,038,762 - Kuwabara , et al. October 18, 2	2011-10-18
Ultrafine-coaxial-wire harness, connecting method thereof, circuit-board-connected body, circuit-board module, and electronic apparatus Grant 7,973,239 - Koyama , et al. July 5, 2	2011-07-05
Process for production of chain metal powders, chain metal powders produced thereby, and anisotropic conductive film formed using the powders Grant 7,850,760 - Kuwabara , et al. December 14, 2	2010-12-14
Grain Classifying Device And Adhesive Containing Grains Classified By The Device App 20100252781 - KOYAMA; Keiji ; et al.	2010-10-07
Nickel Powder Or Alloy Powder Having Nickel As Main Component, Method For Manufacturing The Powder, Conductive Paste And Laminated Ceramic Capacitor App 20100208410 - Okada; Issei ; et al.	2010-08-19
Process For Production Of Chain Metal Powders, Chain Metal Powders Produced Thereby, And Anisotropic Conductive Film Formed By Using The Powders App 20100175507 - KUWABARA; Tetsuya ; et al.	2010-07-15
Circuit-board Module And Manufacturing Method App 20090175019 - Koyama; Keiji ; et al.	2009-07-09
Ultrafine-coaxial-wire Harness, Connecting Method Thereof, Circuit-board-connected Body, Circuit-board Module, And Electronic Apparatus App 20090101408 - Koyama; Keiji ; et al.	2009-04-23
Grain Classifying Device And Adhesive Containing Grains Classified By The Device App 20090032444 - Koyama; Keiji ; et al.	2009-02-05
Method for producing fine metal powder Grant 7,470,306 - Inazawa , et al. December 30, 2	2008-12-30
Anisotropic conductive film and method for producing the same Grant 7,390,442 - Kashihara , et al. June 24, 2	2008-06-24
Method of manufacturing chain-structure metal powder Grant 7,285,152 - Shimoda , et al. October 23, 2	2007-10-23
Process for Production of Chain Metal Powders, Chain Metal Powders Produced Thereby, and Anisotropic Conductive Film Formed Using the Powders App 20070224440 - Kuwabara; Tetsuya ; et al.	2007-09-27
Method for producing fine metal powder App 20050217425 - Inazawa, Shinji ; et al.	2005-10-06
Anisotropic conductive film and method for producing the same App 20050106382 - Kashihara, Hideaki ; et al.	2005-05-19
Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material App 20040221683 - Shimoda, Kohei ; et al.	2004-11-11
Process for producing proteinous material Grant 4,963,370 - Uchida , et al. October 16, 1	1990-10-16

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