Kow; Cheong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kow; Cheong.The latest application filed is for "solid thermally expansible material".
- Kow; Cheong - Troy MI US
| Patent | Date |
|---|---|
| Method for manufacturing physical barriers Grant 8,647,454 - Myers , et al. February 11, 2 | 2014-02-11 |
| Constrained layer damper Grant 7,186,442 - Myers , et al. March 6, 2 | 2007-03-06 |
| Solid thermally expansible material App 20070034432 - Rosenberg; Steven A. ; et al. | 2007-02-15 |
| System and method for manufacturing physical barriers App 20060073266 - Myers; Robert D. ; et al. | 2006-04-06 |
| Constrained layer damper App 20040253453 - Myers, Robert D. ; et al. | 2004-12-16 |
| System and method for manufacturing physical barriers App 20040011282 - Myers, Robert D. ; et al. | 2004-01-22 |
| Acoustic baffle with predetermined directional expansion characteristics App 20020091171 - Blank, Norman E. ; et al. | 2002-07-11 |
| Acoustic baffle with predetermined directional expansion characteristics Grant 6,319,964 - Blank , et al. November 20, 2 | 2001-11-20 |
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