loadpatents
name:-0.0073380470275879
name:-0.025942087173462
name:-0.00053215026855469
Kovac; Zlata Patent Filings

Kovac; Zlata

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kovac; Zlata.The latest application filed is for "methods of making microelectronic assemblies including compliant interfaces".

Company Profile
0.24.4
  • Kovac; Zlata - Los Gatos CA
  • Kovac; Zlata - Los Alamitos CA
  • Kovac; Zlata - Somers NY
  • Kovac; Zlata - Pittsburgh PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods of making microelectronic assemblies including compliant interfaces
Grant 7,368,818 - Kovac , et al. May 6, 2
2008-05-06
Methods of making microelectronic assemblies including compliant interfaces
App 20060049498 - Kovac; Zlata ;   et al.
2006-03-09
Methods of making microelectronic assemblies including compliant interfaces
App 20050139986 - Kovac, Zlata ;   et al.
2005-06-30
Methods of making microelectronic assemblies including compliant interfaces
Grant 6,870,272 - Kovac , et al. March 22, 2
2005-03-22
Methods of making microelectronic assemblies including compliant interfaces
Grant 6,723,584 - Kovac , et al. April 20, 2
2004-04-20
Methods of making microelectronic assemblies including compliant interfaces
Grant 6,525,429 - Kovac , et al. February 25, 2
2003-02-25
Methods of making microelectronic assemblies including compliant interfaces
App 20030027374 - Kovac, Zlata ;   et al.
2003-02-06
Methods of making microelectronic assemblies including compliant interfaces
App 20020109213 - Kovac, Zlata ;   et al.
2002-08-15
Compliant microelectronic mounting device
Grant 6,370,032 - DiStefano , et al. April 9, 2
2002-04-09
Electrical connections with deformable contacts
Grant 6,274,820 - DiStefano , et al. August 14, 2
2001-08-14
Encapsulant for microelectronic devices
Grant 6,255,738 - Distefano , et al. July 3, 2
2001-07-03
Electrical connections with deformable contacts
Grant 6,239,386 - DiStefano , et al. May 29, 2
2001-05-29
Semiconductor chip connection components with adhesives and methods of making same
Grant 6,202,299 - DiStefano , et al. March 20, 2
2001-03-20
Compliant interface for semiconductor chip and method therefor
Grant 6,133,639 - Kovac , et al. October 17, 2
2000-10-17
Method of mounting a connection component on a semiconductor chip with adhesives
Grant 6,045,655 - DiStefano , et al. April 4, 2
2000-04-04
Bondable compliant pads for packaging of a semiconductor chip and method therefor
Grant 6,030,856 - DiStefano , et al. February 29, 2
2000-02-29
Method of forming compliant microelectronic mounting device
Grant 6,012,224 - DiStefano , et al. January 11, 2
2000-01-11
Method of mounting a connection component on a semiconductor chip with adhesives
Grant 5,875,545 - DiStefano , et al. March 2, 1
1999-03-02
Compliant microelectrionic mounting device
Grant 5,706,174 - Distefano , et al. January 6, 1
1998-01-06
Method of fabricating compliant interface for semiconductor chip
Grant 5,659,952 - Kovac , et al. August 26, 1
1997-08-26
Microelectronic bonding with lead motion
Grant 5,619,017 - Distefano , et al. April 8, 1
1997-04-08
Method of making multilayer circuit
Grant 5,590,460 - DiStefano , et al. January 7, 1
1997-01-07
Semiconductor chip connection components with adhesives and methods for bonding to the chip
Grant 5,548,091 - DiStefano , et al. August 20, 1
1996-08-20
Maskless method for electroless plating patterns
Grant 4,239,789 - Blum , et al. December 16, 1
1980-12-16
Water based selectable charge magnetic inks
Grant 4,107,063 - Kovac , et al. August 15, 1
1978-08-15
Water based magnetic inks and the manufacture thereof
Grant 3,990,981 - Kovac , et al. November 9, 1
1976-11-09
Composite Material, Inclusions Thereof, And Method Therefor
Grant 3,876,389 - Chaudhari , et al. April 8, 1
1975-04-08
Method For Electrodepositing Of Alloy Film Of A Given Composition From A Given Solution
Grant 3,716,464 - Kovac , et al. February 13, 1
1973-02-13

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