Patent | Date |
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Methods of making microelectronic assemblies including compliant interfaces Grant 7,368,818 - Kovac , et al. May 6, 2 | 2008-05-06 |
Methods of making microelectronic assemblies including compliant interfaces App 20060049498 - Kovac; Zlata ;   et al. | 2006-03-09 |
Methods of making microelectronic assemblies including compliant interfaces App 20050139986 - Kovac, Zlata ;   et al. | 2005-06-30 |
Methods of making microelectronic assemblies including compliant interfaces Grant 6,870,272 - Kovac , et al. March 22, 2 | 2005-03-22 |
Methods of making microelectronic assemblies including compliant interfaces Grant 6,723,584 - Kovac , et al. April 20, 2 | 2004-04-20 |
Methods of making microelectronic assemblies including compliant interfaces Grant 6,525,429 - Kovac , et al. February 25, 2 | 2003-02-25 |
Methods of making microelectronic assemblies including compliant interfaces App 20030027374 - Kovac, Zlata ;   et al. | 2003-02-06 |
Methods of making microelectronic assemblies including compliant interfaces App 20020109213 - Kovac, Zlata ;   et al. | 2002-08-15 |
Compliant microelectronic mounting device Grant 6,370,032 - DiStefano , et al. April 9, 2 | 2002-04-09 |
Electrical connections with deformable contacts Grant 6,274,820 - DiStefano , et al. August 14, 2 | 2001-08-14 |
Encapsulant for microelectronic devices Grant 6,255,738 - Distefano , et al. July 3, 2 | 2001-07-03 |
Electrical connections with deformable contacts Grant 6,239,386 - DiStefano , et al. May 29, 2 | 2001-05-29 |
Semiconductor chip connection components with adhesives and methods of making same Grant 6,202,299 - DiStefano , et al. March 20, 2 | 2001-03-20 |
Compliant interface for semiconductor chip and method therefor Grant 6,133,639 - Kovac , et al. October 17, 2 | 2000-10-17 |
Method of mounting a connection component on a semiconductor chip with adhesives Grant 6,045,655 - DiStefano , et al. April 4, 2 | 2000-04-04 |
Bondable compliant pads for packaging of a semiconductor chip and method therefor Grant 6,030,856 - DiStefano , et al. February 29, 2 | 2000-02-29 |
Method of forming compliant microelectronic mounting device Grant 6,012,224 - DiStefano , et al. January 11, 2 | 2000-01-11 |
Method of mounting a connection component on a semiconductor chip with adhesives Grant 5,875,545 - DiStefano , et al. March 2, 1 | 1999-03-02 |
Compliant microelectrionic mounting device Grant 5,706,174 - Distefano , et al. January 6, 1 | 1998-01-06 |
Method of fabricating compliant interface for semiconductor chip Grant 5,659,952 - Kovac , et al. August 26, 1 | 1997-08-26 |
Microelectronic bonding with lead motion Grant 5,619,017 - Distefano , et al. April 8, 1 | 1997-04-08 |
Method of making multilayer circuit Grant 5,590,460 - DiStefano , et al. January 7, 1 | 1997-01-07 |
Semiconductor chip connection components with adhesives and methods for bonding to the chip Grant 5,548,091 - DiStefano , et al. August 20, 1 | 1996-08-20 |
Maskless method for electroless plating patterns Grant 4,239,789 - Blum , et al. December 16, 1 | 1980-12-16 |
Water based selectable charge magnetic inks Grant 4,107,063 - Kovac , et al. August 15, 1 | 1978-08-15 |
Water based magnetic inks and the manufacture thereof Grant 3,990,981 - Kovac , et al. November 9, 1 | 1976-11-09 |
Composite Material, Inclusions Thereof, And Method Therefor Grant 3,876,389 - Chaudhari , et al. April 8, 1 | 1975-04-08 |
Method For Electrodepositing Of Alloy Film Of A Given Composition From A Given Solution Grant 3,716,464 - Kovac , et al. February 13, 1 | 1973-02-13 |