Kovac; Caroline A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kovac; Caroline A..The latest application filed is for "method for bonding two surfaces together".

Company Profile

0.13.0

Kovac; Caroline A. - Ridgefield CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for bonding two surfaces together Grant 5,462,628 - Viehbeck , et al. October 31, 1	1995-10-31
Method for conditioning an organic polymeric material Grant 5,242,713 - Viehbeck , et al. September 7, 1	1993-09-07
Method for etching an organic polymeric material Grant 5,203,955 - Viehbeck , et al. April 20, 1	1993-04-20
Means of seeding and metallizing polymide Grant 5,178,914 - Goldblatt , et al. January 12, 1	1993-01-12
Method for conditioning an organic polymeric material Grant 5,135,779 - Viehbeck , et al. August 4, 1	1992-08-04
Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent Grant 5,132,351 - Goldberg , et al. July 21, 1	1992-07-21
Dam for lead encapsulation Grant 5,130,781 - Kovac , et al. July 14, 1	1992-07-14
High strength low stress encapsulation of interconnected semiconductor devices Grant 5,047,834 - Kovac , et al. September 10, 1	1991-09-10
Dam for lead encapsulation Grant 4,881,885 - Kovac , et al. November 21, 1	1989-11-21
Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization Grant 4,869,930 - Clarke , et al. September 26, 1	1989-09-26
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween Grant 4,862,322 - Bickford , et al. August 29, 1	1989-08-29
Precision solder transfer method and means Grant 4,832,255 - Bickford , et al. May 23, 1	1989-05-23
Selective deposition of copper Grant 4,574,095 - Baum , et al. March 4, 1	1986-03-04

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