loadpatents
name:-0.011489868164062
name:-0.0097830295562744
name:-0.01012110710144
Koul; Amendra Patent Filings

Koul; Amendra

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koul; Amendra.The latest application filed is for "integrating graphene into the skin depth region of high speed communications signals for a printed circuit board".

Company Profile
10.8.10
  • Koul; Amendra - San Francisco CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optimizing design and performance for printed circuit boards
Grant 11,425,821 - Koul , et al. August 23, 2
2022-08-23
Integrating Graphene Into The Skin Depth Region Of High Speed Communications Signals For A Printed Circuit Board
App 20220217837 - Goergen; Joel ;   et al.
2022-07-07
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
Grant 11,330,702 - Goergen , et al. May 10, 2
2022-05-10
Fiber Weave Skew Assessment For Printed Circuit Boards
App 20220128350 - Koul; Amendra ;   et al.
2022-04-28
Fiber Weave Skew Assessment For Printed Circuit Boards
App 20220120558 - Koul; Amendra ;   et al.
2022-04-21
Fiber weave skew assessment for printed circuit boards
Grant 11,293,752 - Koul , et al. April 5, 2
2022-04-05
Fiber weave skew assessment for printed circuit boards
Grant 11,287,245 - Koul , et al. March 29, 2
2022-03-29
Providing One Or More Carbon Layers To A Copper Conductive Material To Reduce Power Loss In A Power Plane
App 20220039257 - Goergen; Joel ;   et al.
2022-02-03
Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
Grant 11,202,368 - Goergen , et al. December 14, 2
2021-12-14
Providing One Or More Carbon Layers To A Copper Conductive Material To Reduce Power Loss In A Power Plane
App 20210337666 - Goergen; Joel ;   et al.
2021-10-28
Integrating Graphene Into The Skin Depth Region Of High Speed Communications Signals For A Printed Circuit Board
App 20210337657 - Goergen; Joel ;   et al.
2021-10-28
Optimizing Design And Performance For Printed Circuit Boards
App 20210059055 - Koul; Amendra ;   et al.
2021-02-25
Fiber Weave Skew Assessment For Printed Circuit Boards
App 20200263977 - Koul; Amendra ;   et al.
2020-08-20
Fiber Weave Skew Assessment For Printed Circuit Boards
App 20200263976 - Koul; Amendra ;   et al.
2020-08-20
Removal of channel impairments due to skew and channel asymmetry with a composite filter
Grant 10,735,039 - Goergen , et al.
2020-08-04
Fiber weave skew assessment for printed circuit boards
Grant 10,684,123 - Koul , et al.
2020-06-16
Measuring effective dielectric constant using via-stub resonance
Grant 10,674,598 - Nozadze , et al.
2020-06-02
Fiber Weave Skew Assessment For Printed Circuit Boards
App 20190219385 - Koul; Amendra ;   et al.
2019-07-18

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