Kothari; Shrenik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kothari; Shrenik.The latest application filed is for "stacked die architectures with improved thermal management".

Company Profile

6.2.10

Kothari; Shrenik - Chandler AZ
KOTHARI; Shrenik - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sloped metal features for cooling hotspots in stacked-die packages Grant 11,398,414 - Wan , et al. July 26, 2	2022-07-26
Stacked Die Architectures With Improved Thermal Management App 20210375719 - Eid; Feras ; et al.	2021-12-02
Customized Integrated Heat Spreader Design With Targeted Doping For Multi-chip Packages App 20210257272 - KOTHARI; Shrenik ; et al.	2021-08-19
Semiconductor Device Stack-up With Bulk Substrate Material To Mitigate Hot Spots App 20210028087 - KOTHARI; Shrenik ; et al.	2021-01-28
Thermal Management Solutions Using Self-healing Polymeric Thermal Interface Materials App 20200294886 - Saha; Amitesh ; et al.	2020-09-17
Multi-surface Heat Sink Suitable For Multi-chip Packages App 20200251403 - Kind Code	2020-08-06
Multi-piece Heat Spreader For Multi-chip Package App 20200194332 - Ahuja; Sandeep ; et al.	2020-06-18
Sloped Metal Features For Cooling Hotspots In Stacked-die Packages App 20200098666 - WAN; ZHIMIN ; et al.	2020-03-26
Stacked Die Architectures With Improved Thermal Management App 20190214328 - Eid; Feras ; et al.	2019-07-11
Sintered Heat Spreaders With Inserts App 20190027379 - Hu; Wei ; et al.	2019-01-24
Embedded air core inductors for integrated circuit package substrates with thermal conductor Grant 9,515,003 - Fitzgerald , et al. December 6, 2	2016-12-06

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