KOTHARI; Hiten

Patent Applications and Registrations

Patent applications and USPTO patent grants for KOTHARI; Hiten.The latest application filed is for "contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication".

Company Profile

4.9.12

KOTHARI; Hiten - Beaverton OR
Kothari; Hiten - Hillsboro OR
Kothari; Hiten - Ilillsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Contact Over Active Gate Structures With Etch Stop Layers For Advanced Integrated Circuit Structure Fabrication App 20220310516 - MADHAVAN; Atul ; et al.	2022-09-29
Resistive random access memory device with switching multi-layer stack and methods of fabrication Grant 11,430,948 - Glassman , et al. August 30, 2	2022-08-30
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication Grant 11,393,754 - Madhavan , et al. July 19, 2	2022-07-19
A Resistive Random Access Memory Device With Switching Multi-layer Stack And Methods Of Fabrication App 20200203603 - Glassman; Timothy ; et al.	2020-06-25
A Resistive Random Access Memory Device And Methods Of Fabrication App 20200203602 - Asuri; Namrata S. ; et al.	2020-06-25
Contact Over Active Gate Structures With Etch Stop Layers For Advanced Integrated Circuit Structure Fabrication App 20200105672 - MADHAVAN; Atul ; et al.	2020-04-02
Chip Assemblies Employing Solder Bonds To Back-side Lands Including An Electrolytic Nickel Layer App 20190237391 - SATTIRAJU; Seshu V. ; et al.	2019-08-01
Anchored interconnect Grant 9,818,710 - Kang , et al. November 14, 2	2017-11-14
Preservation of fine pitch redistribution lines Grant 9,721,886 - Lee , et al. August 1, 2	2017-08-01
Anchored Interconnect App 20170069589 - KANG; JIHO ; et al.	2017-03-09
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach Grant 9,530,740 - Lee , et al. December 27, 2	2016-12-27
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias Grant 9,449,913 - Lee , et al. September 20, 2	2016-09-20
Preservation Of Fine Pitch Redistribution Lines App 20160181196 - Lee; Kevin J. ; et al.	2016-06-23
3d Interconnect Structure Comprising Through-silicon Vias Combined With Fine Pitch Backside Metal Redistribution Lines Fabricated Using A Dual Damascene Type Approach App 20150364425 - Lee; Kevin J. ; et al.	2015-12-17
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach Grant 9,142,510 - Lee , et al. September 22, 2	2015-09-22
3d Interconnect Structure Comprising Through-silicon Vias Combined With Fine Pitch Backside Metal Redistribution Lines Fabricated Using A Dual Damascene Type Approach App 20130285257 - Lee; Kevin J. ; et al.	2013-10-31
3d Interconnect Structure Comprising Fine Pitch Single Damascene Backside Metal Redistribution Lines Combined With Through-silicon Vias App 20130256910 - Lee; Kevin J. ; et al.	2013-10-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.