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Patent applications and USPTO patent grants for Kostiew; George S..The latest application filed is for "thermocompression bonding using plasma gas".
Patent | Date |
---|---|
Thermocompression bonding using plasma gas Grant 10,297,567 - Lu , et al. | 2019-05-21 |
High performance transient uniform cooling solution for thermal compression bonding process Grant 9,943,931 - Li , et al. April 17, 2 | 2018-04-17 |
Thermocompression Bonding Using Plasma Gas App 20170179070 - Lu; Donglai David ;   et al. | 2017-06-22 |
Adaptive Tcb By Data Feed Forward App 20170154828 - GOSSELIN; Timothy A. ;   et al. | 2017-06-01 |
High Performance Transient Uniform Cooling Solution For Thermal Compression Bonding Process App 20170014957 - Li; Zhihua ;   et al. | 2017-01-19 |
High performance transient uniform cooling solution for thermal compression bonding process Grant 9,434,029 - Li , et al. September 6, 2 | 2016-09-06 |
Thermal Compression Bonding Process Cooling Manifold App 20160211238 - Dhavaleswarapu; Hemanth ;   et al. | 2016-07-21 |
High Performance Transient Uniform Cooling Solution For Thermal Compression Bonding Process App 20130299133 - Li; Zhihua ;   et al. | 2013-11-14 |
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