Kosteva, Stephen John
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kosteva, Stephen John.The latest application filed is for "integral design features for heatsink attach for electronic packages".
- Kosteva, Stephen John - Endicott NY
| Patent | Date |
|---|---|
| Integral design features for heatsink attach for electronic packages App 20010005312 - Johnson, Eric Arthur ; et al. | 2001-06-28 |
| Integral design features for heatsink attach for electronic packages Grant 5,969,947 - Johnson , et al. October 19, 1 | 1999-10-19 |
| Apparatus and process for improved die adhesion to organic chip carriers Grant 5,955,782 - Kosteva , et al. September 21, 1 | 1999-09-21 |
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