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Patent applications and USPTO patent grants for Koshimizu; Hideki.The latest application filed is for "method of manufacturing packaged wafer".
Patent | Date |
---|---|
Method of dividing a wafer by back grinding Grant 10,312,144 - Koshimizu , et al. | 2019-06-04 |
Method of manufacturing packaged wafer Grant 10,269,639 - Koshimizu , et al. | 2019-04-23 |
Packaged wafer manufacturing method and device chip manufacturing method Grant 9,892,986 - Koshimizu , et al. February 13, 2 | 2018-02-13 |
Packaged Wafer Manufacturing Method And Device Chip Manufacturing Method App 20170294364 - Koshimizu; Hideki ;   et al. | 2017-10-12 |
Method Of Manufacturing Packaged Wafer App 20170294353 - Koshimizu; Hideki ;   et al. | 2017-10-12 |
Wafer Processing Method App 20170271208 - Koshimizu; Hideki ;   et al. | 2017-09-21 |
Wafer processing method using adhesive tape to pick up device chips Grant 9,716,040 - Haimoto , et al. July 25, 2 | 2017-07-25 |
Wafer Processing Method App 20170053830 - Haimoto; Takashi ;   et al. | 2017-02-23 |
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