loadpatents
Patent applications and USPTO patent grants for Kosgalwies; Sven.The latest application filed is for "integrated circuit devices with bump structures that include a protection layer".
Patent | Date |
---|---|
Integrated Circuit Devices With Bump Structures That Include A Protection Layer App 20140021604 - Kuechenmeister; Frank ;   et al. | 2014-01-23 |
Methods of forming bump structures that include a protection layer Grant 8,580,672 - Kuechenmeister , et al. November 12, 2 | 2013-11-12 |
Micro-machined structure production using encapsulation Grant 8,435,612 - Hantschel , et al. May 7, 2 | 2013-05-07 |
Methods of Forming Bump Structures That Include a Protection Layer App 20130099372 - Kuechenmeister; Frank ;   et al. | 2013-04-25 |
Micro-Machined Structure Production Using Encapsulation App 20120021170 - Hantschel; Thomas ;   et al. | 2012-01-26 |
Micro-machined structure production using encapsulation Grant 8,080,293 - Hantschel , et al. December 20, 2 | 2011-12-20 |
Self-releasing spring structures and methods Grant 7,943,504 - Hantschel , et al. May 17, 2 | 2011-05-17 |
Micro-Machined Structure Production Using Encapsulation App 20100184311 - Hantschel; Thomas ;   et al. | 2010-07-22 |
Micro-machined structure production using encapsulation Grant 7,730,615 - Hantschel , et al. June 8, 2 | 2010-06-08 |
Self-Releasing Spring Structures And Methods App 20090077807 - Hantschel; Thomas ;   et al. | 2009-03-26 |
Self-releasing spring structures and methods Grant 7,456,092 - Hantschel , et al. November 25, 2 | 2008-11-25 |
Micro-machined structure production using encapsulation App 20080146052 - Hantschel; Thomas ;   et al. | 2008-06-19 |
Micro-machined structure production using encapsulation Grant 7,356,920 - Hantschel , et al. April 15, 2 | 2008-04-15 |
Micro-machined structure production using encapsulation App 20060105122 - Hantschel; Thomas ;   et al. | 2006-05-18 |
Self-releasing spring structures and methods App 20060076693 - Hantschel; Thomas ;   et al. | 2006-04-13 |
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