| Patent | Date |
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Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
Grant 9,589,879 - Kosenko , et al. March 7, 2 | 2017-03-07 |
Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor
Grant 9,515,024 - Kosenko , et al. December 6, 2 | 2016-12-06 |
Structures formed using monocrystalline silicon and/or other materials for optical and other applications
Grant 9,323,010 - Kosenko , et al. April 26, 2 | 2016-04-26 |
Structures With Through Vias Passing Through A Substrate Comprising A Planar Insulating Layer Between Semiconductor
App 20150348843 - KOSENKO; Valentin ; et al. | 2015-12-03 |
Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
Grant 9,142,511 - Kosenko , et al. September 22, 2 | 2015-09-22 |
Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
Grant 9,111,902 - Savastiouk , et al. August 18, 2 | 2015-08-18 |
Substrates With Through Vias With Conductive Features For Connection To Integrated Circuit Elements, And Methods For Forming Through Vias In Substrates
App 20150228570 - KOSENKO; Valentin ; et al. | 2015-08-13 |
Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
Grant 9,018,094 - Kosenko , et al. April 28, 2 | 2015-04-28 |
Structures With Through Vias Passing Through A Substrate Comprising A Planar Insulating Layer Between Semiconductor Layers
App 20140346646 - KOSENKO; Valentin ; et al. | 2014-11-27 |
Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
Grant 8,829,683 - Kosenko , et al. September 9, 2 | 2014-09-09 |
Optical interposer
Grant 8,757,897 - Kosenko , et al. June 24, 2 | 2014-06-24 |
Dielectric Trenches, Nickel/tantalum Oxide Structures, And Chemical Mechanical Polishing Techniques
App 20140131836 - Savastiouk; Sergey ; et al. | 2014-05-15 |
Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
Grant 8,633,589 - Savastiouk , et al. January 21, 2 | 2014-01-21 |
Structures With Through Vias Passing Through A Substrate Comprising A Planar Insulating Layer Between Semiconductor Layers
App 20130214429 - Kosenko; Valentin ; et al. | 2013-08-22 |
Structures Formed Using Monocrystalline Silicon And/or Other Materials For Optical And Other Applications
App 20130177274 - Kosenko; Valentin ; et al. | 2013-07-11 |
Optical Interposer
App 20130177281 - Kosenko; Valentin ; et al. | 2013-07-11 |
Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
Grant 8,431,431 - Kosenko , et al. April 30, 2 | 2013-04-30 |
Structures With Through Vias Passing Through A Substrate Comprising A Planar Insulating Layer Between Semiconductor Layers
App 20130015585 - Kosenko; Valentin ; et al. | 2013-01-17 |
Substrates With Through Vias With Conductive Features For Connection To Integrated Circuit Elements, And Methods For Forming Through Vias In Substrates
App 20120228778 - Kosenko; Valentin ; et al. | 2012-09-13 |
Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
Grant 7,964,508 - Savastiouk , et al. June 21, 2 | 2011-06-21 |
Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
Grant 7,510,928 - Savastiouk , et al. March 31, 2 | 2009-03-31 |
Dielectric Trenches, Nickel/tantalum Oxide Structures, And Chemical Mechanical Polishing Techniques
App 20080311749 - Savastiouk; Sergey ; et al. | 2008-12-18 |
Agitation Of Electrolytic Solution In Electrodeposition
App 20080271995 - Savastiouk; Sergey ; et al. | 2008-11-06 |
Integrated Circuits With Conductive Features In Through Holes Passing Through Other Conductive Features And Through A Semiconductor Substrate
App 20080164574 - Savastiouk; Sergey ; et al. | 2008-07-10 |
Integrated Circuits With Conductive Features In Through Holes Passing Through Other Conductive Features And Through A Semiconductor Substrate
App 20080136038 - Savastiouk; Sergey ; et al. | 2008-06-12 |
Dielectric Trenches, Nickel/tantalum Oxide Structures, And Chemical Mechanical Polishing Techniques
App 20080025009 - Savastiouk; Sergey ; et al. | 2008-01-31 |
Dielectric trenches, nickel/tantalum oxide structures,and chemical mechanical polishing techniques
App 20070257367 - Savastiouk; Sergey ; et al. | 2007-11-08 |
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