Kosaka; Wataru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kosaka; Wataru.The latest application filed is for "polyarylene sulfide resin composition and a molded article formed therefrom".

Company Profile

0.5.6

Kosaka; Wataru - Ichihara N/A JP
Kosaka; Wataru - Chiba JP
Kosaka; Wataru - Ichihara-shi JP
KOSAKA, WATARU - SHIZUOKA JP
Kosaka; Wataru - Sodegaura-machi JP
Kosaka; Wataru - Utsunomiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyarylene sulfide resin composition and a molded article formed therefrom Grant 8,487,042 - Okubo , et al. July 16, 2	2013-07-16
Polyarylene Sulfide Resin Composition And A Molded Article Formed Therefrom App 20100063192 - Okubo; Naoto ; et al.	2010-03-11
Insulating and thermally conductive resin composition, molded article and method of producing the composition App 20060247355 - Kosaka; Wataru ; et al.	2006-11-02
Processes For The Production Of Prepregs And Laminated Sheets App 20030127186 - TOMINAGA, YASUSHI ; et al.	2003-07-10
Polyarylene sulfide resin composition App 20020188096 - Tsubokura, Yutaka ; et al.	2002-12-12
Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use App 20020187267 - Tamura, Eiji ; et al.	2002-12-12
Method of producing the plated molded articles by non-electrode plating, and the resin compositions for that use App 20010051682 - Tamura, Eiji ; et al.	2001-12-13
Polyarylene sulfide resin compositions Grant 6,117,950 - Yamao , et al. September 12, 2	2000-09-12
Polyarylene sulfide from aromatic compound having at least three functional groups Grant 5,231,163 - Kosaka , et al. July 27, 1	1993-07-27
Epoxy resin composition for semiconductor sealing Grant 5,143,951 - Ohta , et al. September 1, 1	1992-09-01

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