loadpatents
name:-0.014187097549438
name:-0.010876178741455
name:-0.0050039291381836
KOSAKA; Toshiyuki Patent Filings

KOSAKA; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KOSAKA; Toshiyuki.The latest application filed is for "semiconductor device and semiconductor apparatus".

Company Profile
4.13.11
  • KOSAKA; Toshiyuki - Yokohama-shi JP
  • Kosaka; Toshiyuki - Yokohama JP
  • Kosaka; Toshiyuki - Settsu JP
  • Kosaka; Toshiyuki - Settsu-shi JP
  • Kosaka; Toshiyuki - Kanagawa JP
  • Kosaka; Toshiyuki - Yamanashi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device And Semiconductor Apparatus
App 20210193520 - KOSAKA; Toshiyuki ;   et al.
2021-06-24
Semiconductor Device
App 20210166970 - KOSAKA; Toshiyuki ;   et al.
2021-06-03
Process of forming semiconductor device
Grant 10,957,591 - Kosaka , et al. March 23, 2
2021-03-23
Method of manufacturing semiconductor device
Grant 10,943,821 - Kosaka , et al. March 9, 2
2021-03-09
Method Of Manufacturing Semiconductor Device
App 20200035551 - KOSAKA; Toshiyuki ;   et al.
2020-01-30
Process Of Forming Semiconductor Device
App 20190259662 - KOSAKA; Toshiyuki ;   et al.
2019-08-22
Synthetic-fiber rope
Grant 10,100,462 - Kikuchi , et al. October 16, 2
2018-10-16
Method for manufacturing semiconductor device
Grant 9,368,405 - Kosaka , et al. June 14, 2
2016-06-14
Method For Manufacturing Semiconductor Device
App 20150221554 - KOSAKA; Toshiyuki ;   et al.
2015-08-06
Synthetic-fiber Rope
App 20150152594 - Kikuchi; Yuzo ;   et al.
2015-06-04
Process for dividing wafer into individual chips and semiconductor chips
Grant 8,563,404 - Kosaka October 22, 2
2013-10-22
Process to form via hole in semiconductor wafer
Grant 8,563,433 - Kosaka October 22, 2
2013-10-22
Manufacturing method of semiconductor device
Grant 8,476,166 - Kosaka , et al. July 2, 2
2013-07-02
Semiconductor device
Grant 8,455,951 - Kosaka June 4, 2
2013-06-04
Process To Form Via Hole In Semiconductor Wafer
App 20120028465 - KOSAKA; Toshiyuki
2012-02-02
Process For Dividing Wafer Into Individual Chips And Semiconductor Chips
App 20120025207 - KOSAKA; Toshiyuki
2012-02-02
Semiconductor Device
App 20110084341 - Kosaka; Toshiyuki
2011-04-14
Manufacturing Method Of Semiconductor Device
App 20110081784 - Kosaka; Toshiyuki ;   et al.
2011-04-07
Semiconductor device and method of manufacturing the same
Grant 7,754,616 - Kosaka , et al. July 13, 2
2010-07-13
Semiconductor device and method of manufacturing the same
App 20070207614 - Kosaka; Toshiyuki ;   et al.
2007-09-06

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