Patent | Date |
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Silicide formation on a wafer Grant 9,379,020 - Gerritsen , et al. June 28, 2 | 2016-06-28 |
Apparatus for cleaning of circuit substrates Grant 8,752,228 - Farkas , et al. June 17, 2 | 2014-06-17 |
Capping layer formation onto a dual damescene interconnect Grant 8,263,430 - Farkas , et al. September 11, 2 | 2012-09-11 |
Pulsed chemical dispense system Grant 8,257,506 - Dubreuil , et al. September 4, 2 | 2012-09-04 |
Fabrication Of Self-assembled Nanowire-type Interconnects On A Semiconductor Device App 20120133031 - COOPER; Kevin ;   et al. | 2012-05-31 |
Fabrication of self-assembled nanowire-type interconnects on a semiconductor device Grant 8,097,535 - Cooper , et al. January 17, 2 | 2012-01-17 |
Semiconductor substrate temperature determination Grant 8,066,430 - Kordic , et al. November 29, 2 | 2011-11-29 |
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device Grant 7,951,729 - Farkas , et al. May 31, 2 | 2011-05-31 |
System and method for removing particles from a polishing pad Grant 7,883,393 - Kordic , et al. February 8, 2 | 2011-02-08 |
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device Grant 7,803,719 - Farkas , et al. September 28, 2 | 2010-09-28 |
Semiconductor Device Including A Coupled Dielectric Layer And Metal Layer, Method Of Fabrication Thereor, And Material For Coupling A Dielectric Layer And A Metal Layer In A Semiconductor Device App 20100139526 - FARKAS; Janos ;   et al. | 2010-06-10 |
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device Grant 7,691,756 - Farkas , et al. April 6, 2 | 2010-04-06 |
Fabrication Of Self-assembled Nanowire-type Interconnects On A Semiconductor Device App 20100052116 - Cooper; Kevin ;   et al. | 2010-03-04 |
Silicide Formation On A Wafer App 20100013090 - Gerritsen; Eric ;   et al. | 2010-01-21 |
Integrated System For Semiconductor Substrate Processing Using Liquid Phase Metal Deposition App 20090301867 - Farkas; Janos ;   et al. | 2009-12-10 |
Method Of Manufacturing A Semiconductor Device, Semiconductor Device Obtained Herewith, And Slurry Suitable For Use In Such A Method App 20090206450 - Kordic; Srdjan | 2009-08-20 |
Wafer De-chucking App 20090186560 - Kordic; Srdjan | 2009-07-23 |
Semiconductor Substrate Temperature Determination App 20090175313 - Kordic; Srdjan ;   et al. | 2009-07-09 |
Semiconductor Device Including A Coupled Dielectric Layer And Metal Layer, Method Of Fabrication Thereof, And Passivating Coupling Material Comprising Multiple Organic Components For Use In A Semiconductor Device App 20090115031 - Farkas; Janos ;   et al. | 2009-05-07 |
Pulsed Chemical Dispense System App 20090007938 - Dubreuil; Olivier ;   et al. | 2009-01-08 |
System and Method for Removing Particles From a Polishing Pad App 20080287041 - Kordic; Srdjan ;   et al. | 2008-11-20 |
Apparatus for Cleaning of Circuit Substrates App 20080271274 - Kordic; Srdjan ;   et al. | 2008-11-06 |
Capping Layer Formation Onto a Dual Damescene Interconnect App 20080242110 - Farkas; Janos ;   et al. | 2008-10-02 |
Semiconductor Device Including a Coupled Dielectric Layer and Metal Layer, Method of Fabrication Thereof, and Material for Coupling a Dielectric Layer and a Metal Layer in a Semiconductor Device App 20080197487 - Farkas; Janos ;   et al. | 2008-08-21 |
Process for fabricating an electrical circuit comprising a polishing step Grant 7,064,053 - Kordic , et al. June 20, 2 | 2006-06-20 |
Electrical connection device between two tracks of an integrated circuit Grant 6,917,116 - Kordic , et al. July 12, 2 | 2005-07-12 |
Electrical connection device between two tracks of an integrated circuit App 20040140565 - Kordic, Srdjan ;   et al. | 2004-07-22 |
Process for fabricating an electrical circuit comprising a polishing step App 20040087140 - Kordic, Srdjan ;   et al. | 2004-05-06 |
Semiconductor device and method of manufacturing such a device Grant 6,201,291 - Kordic , et al. March 13, 2 | 2001-03-13 |