loadpatents
name:-0.018202066421509
name:-0.013986825942993
name:-0.00048613548278809
Kordic; Srdjan Patent Filings

Kordic; Srdjan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kordic; Srdjan.The latest application filed is for "fabrication of self-assembled nanowire-type interconnects on a semiconductor device".

Company Profile
0.15.16
  • Kordic; Srdjan - Biviers N/A FR
  • Kordic; Srdjan - Eindhoven NL
  • Kordic; Srdjan - Bernin NL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silicide formation on a wafer
Grant 9,379,020 - Gerritsen , et al. June 28, 2
2016-06-28
Apparatus for cleaning of circuit substrates
Grant 8,752,228 - Farkas , et al. June 17, 2
2014-06-17
Capping layer formation onto a dual damescene interconnect
Grant 8,263,430 - Farkas , et al. September 11, 2
2012-09-11
Pulsed chemical dispense system
Grant 8,257,506 - Dubreuil , et al. September 4, 2
2012-09-04
Fabrication Of Self-assembled Nanowire-type Interconnects On A Semiconductor Device
App 20120133031 - COOPER; Kevin ;   et al.
2012-05-31
Fabrication of self-assembled nanowire-type interconnects on a semiconductor device
Grant 8,097,535 - Cooper , et al. January 17, 2
2012-01-17
Semiconductor substrate temperature determination
Grant 8,066,430 - Kordic , et al. November 29, 2
2011-11-29
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device
Grant 7,951,729 - Farkas , et al. May 31, 2
2011-05-31
System and method for removing particles from a polishing pad
Grant 7,883,393 - Kordic , et al. February 8, 2
2011-02-08
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device
Grant 7,803,719 - Farkas , et al. September 28, 2
2010-09-28
Semiconductor Device Including A Coupled Dielectric Layer And Metal Layer, Method Of Fabrication Thereor, And Material For Coupling A Dielectric Layer And A Metal Layer In A Semiconductor Device
App 20100139526 - FARKAS; Janos ;   et al.
2010-06-10
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
Grant 7,691,756 - Farkas , et al. April 6, 2
2010-04-06
Fabrication Of Self-assembled Nanowire-type Interconnects On A Semiconductor Device
App 20100052116 - Cooper; Kevin ;   et al.
2010-03-04
Silicide Formation On A Wafer
App 20100013090 - Gerritsen; Eric ;   et al.
2010-01-21
Integrated System For Semiconductor Substrate Processing Using Liquid Phase Metal Deposition
App 20090301867 - Farkas; Janos ;   et al.
2009-12-10
Method Of Manufacturing A Semiconductor Device, Semiconductor Device Obtained Herewith, And Slurry Suitable For Use In Such A Method
App 20090206450 - Kordic; Srdjan
2009-08-20
Wafer De-chucking
App 20090186560 - Kordic; Srdjan
2009-07-23
Semiconductor Substrate Temperature Determination
App 20090175313 - Kordic; Srdjan ;   et al.
2009-07-09
Semiconductor Device Including A Coupled Dielectric Layer And Metal Layer, Method Of Fabrication Thereof, And Passivating Coupling Material Comprising Multiple Organic Components For Use In A Semiconductor Device
App 20090115031 - Farkas; Janos ;   et al.
2009-05-07
Pulsed Chemical Dispense System
App 20090007938 - Dubreuil; Olivier ;   et al.
2009-01-08
System and Method for Removing Particles From a Polishing Pad
App 20080287041 - Kordic; Srdjan ;   et al.
2008-11-20
Apparatus for Cleaning of Circuit Substrates
App 20080271274 - Kordic; Srdjan ;   et al.
2008-11-06
Capping Layer Formation Onto a Dual Damescene Interconnect
App 20080242110 - Farkas; Janos ;   et al.
2008-10-02
Semiconductor Device Including a Coupled Dielectric Layer and Metal Layer, Method of Fabrication Thereof, and Material for Coupling a Dielectric Layer and a Metal Layer in a Semiconductor Device
App 20080197487 - Farkas; Janos ;   et al.
2008-08-21
Process for fabricating an electrical circuit comprising a polishing step
Grant 7,064,053 - Kordic , et al. June 20, 2
2006-06-20
Electrical connection device between two tracks of an integrated circuit
Grant 6,917,116 - Kordic , et al. July 12, 2
2005-07-12
Electrical connection device between two tracks of an integrated circuit
App 20040140565 - Kordic, Srdjan ;   et al.
2004-07-22
Process for fabricating an electrical circuit comprising a polishing step
App 20040087140 - Kordic, Srdjan ;   et al.
2004-05-06
Semiconductor device and method of manufacturing such a device
Grant 6,201,291 - Kordic , et al. March 13, 2
2001-03-13

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