Kopannia; Siegfried
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kopannia; Siegfried.The latest application filed is for "electrical debonding of pu hot melt adhesives by use of conductive inks".
- Kopannia; Siegfried - Krefeld DE
- Kopannia; Siegfried - Duesseldorf DE
| Patent | Date |
|---|---|
| Thermally conductive adhesive Grant 10,689,551 - Butterbach , et al. | 2020-06-23 |
| Electrical debonding of PU hot melt adhesives by use of conductive inks Grant 10,590,310 - Heucher , et al. | 2020-03-17 |
| Electrical Debonding of PU Hot Melt Adhesives By Use of Conductive Inks App 20180340097 - Heucher; Reimar ; et al. | 2018-11-29 |
| Thermally Conductive Adhesive App 20170362473 - BUTTERBACH; Ruediger ; et al. | 2017-12-21 |
| Polyamide Hot Melt Coating App 20170158909 - Marchese; Luca ; et al. | 2017-06-08 |
| Reactive two-component hotmelt adhesive composition Grant 9,487,686 - Butterbach , et al. November 8, 2 | 2016-11-08 |
| Composite material containing natural fibers Grant 8,969,440 - Kopannia , et al. March 3, 2 | 2015-03-03 |
| Electrically Divisible Polyamide Adhesive App 20140374032 - Heucher; Reimar ; et al. | 2014-12-25 |
| Reactive Two-component Hotmelt Adhesive Composition App 20140287173 - Butterbach; Ruediger ; et al. | 2014-09-25 |
| Composite Material Containing Natural Fibers App 20130150490 - Kopannia; Siegfried ; et al. | 2013-06-13 |
| Hydrolytically Stable Polyamide App 20120175817 - Becker; Bettina ; et al. | 2012-07-12 |
| Metal-to-polymer Bonding Using An Adhesive Based On Epoxides App 20110297318 - Barriau; Emilie ; et al. | 2011-12-08 |
| Molded Parts From Hot Melt Adhesives App 20090291288 - Kopannia; Siegfried ; et al. | 2009-11-26 |
| Method Of Adhesively Bonding A First Component To A Second Component App 20080196831 - Friese; Carsten ; et al. | 2008-08-21 |
| Water-swellable hot-melt-type adhesive Grant 6,803,400 - Butterbach , et al. October 12, 2 | 2004-10-12 |
| Hot-melt adhesive for glueing DVDs Grant 6,767,424 - Butterbach , et al. July 27, 2 | 2004-07-27 |
| Swellable hotmelt adhesive Grant 6,677,394 - Butterbach , et al. January 13, 2 | 2004-01-13 |
| Hot-melt adhesive for gluing digital versatile discs Grant 6,228,456 - Butterbach , et al. May 8, 2 | 2001-05-08 |
| Thermoplastic hotmelt adhesive Grant 5,512,625 - Butterbach , et al. April 30, 1 | 1996-04-30 |
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