Koopmans; Michel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koopmans; Michel.The latest application filed is for "thermal pads between stacked semiconductor dies and associated systems and methods".

Company Profile

7.35.32

Koopmans; Michel - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Memory arrays, and methods of forming memory arrays Grant 11,004,494 - Tang , et al. May 11, 2	2021-05-11
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods App 20200411482 - Gandhi; Jaspreet S. ; et al.	2020-12-31
Thermal pads between stacked semiconductor dies and associated systems and methods Grant 10,651,155 - Gandhi , et al.	2020-05-12
Semiconductor device test apparatuses comprising at least one test site having an array of pockets Grant 10,481,200 - Gandhi , et al. Nov	2019-11-19
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods Grant 10,461,059 - Koopmans , et al. Oc	2019-10-29
Memory Arrays, and Methods of Forming Memory Arrays App 20190172517 - Tang; Sanh D. ; et al.	2019-06-06
Apparatuses and methods for forming die stacks Grant 10,269,782 - Koopmans	2019-04-23
Memory arrays, and methods of forming memory arrays Grant 10,242,726 - Tang , et al.	2019-03-26
Semiconductor Device Test Apparatuses App 20190072608 - Gandhi; Jaspreet S. ; et al.	2019-03-07
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods App 20190006323 - Gandhi; Jaspreet S. ; et al.	2019-01-03
Memory arrays, and methods of forming memory arrays Grant 10,153,027 - Tang , et al. Dec	2018-12-11
Apparatuses And Methods For Forming Die Stacks App 20180337166 - Koopmans; Michel	2018-11-22
Methods of testing semiconductor devices comprising a die stack having protruding conductive elements Grant 10,126,357 - Gandhi , et al. November 13, 2	2018-11-13
Thermal pads between stacked semiconductor dies and associated systems and methods Grant 10,096,579 - Gandhi , et al. October 9, 2	2018-10-09
Memory arrays Grant 10,083,734 - Tang , et al. September 25, 2	2018-09-25
Apparatuses and methods for forming die stacks Grant 10,062,679 - Koopmans August 28, 2	2018-08-28
Apparatuses And Methods For Forming Die Stacks App 20180108645 - Koopmans; Michel	2018-04-19
Apparatuses and methods for forming die stacks Grant 9,881,910 - Koopmans January 30, 2	2018-01-30
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods App 20170352645 - Gandhi; Jaspreet S. ; et al.	2017-12-07
Methods Of Testing Semiconductor Devices App 20170336470 - Gandhi; Jaspreet S. ; et al.	2017-11-23
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods Grant 9,818,625 - Li , et al. November 14, 2	2017-11-14
Thermal pads between stacked semiconductor dies and associated systems and methods Grant 9,768,147 - Gandhi , et al. September 19, 2	2017-09-19
Semiconductor device test apparatuses Grant 9,733,304 - Gandhi , et al. August 15, 2	2017-08-15
Apparatuses And Methods For Forming Die Stacks App 20170221873 - KOOPMANS; MICHEL	2017-08-03
Methods of fabricating semiconductor die assemblies Grant 9,711,494 - England , et al. July 18, 2	2017-07-18
Apparatuses And Methods For Forming Die Stacks App 20170170158 - KOOPMANS; MICHEL	2017-06-15
Apparatuses and methods for forming die stacks Grant 9,659,917 - Koopmans May 23, 2	2017-05-23
Semiconductor die assemblies and semiconductor devices including same Grant 9,379,091 - England , et al. June 28, 2	2016-06-28
Stacked Semiconductor Die Assemblies With Thermal Spacers And Associated Systems And Methods App 20160181125 - Li; Jian ; et al.	2016-06-23
Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages Grant 9,362,143 - Sun , et al. June 7, 2	2016-06-07
Stacked Semiconductor Die Assemblies With Improved Thermal Performance And Associated Systems And Methods App 20160141270 - Koopmans; Michel ; et al.	2016-05-19
Apparatus For Testing Stacked Die Assemblies, And Related Methods App 20160084905 - Gandhi; Jaspreet S. ; et al.	2016-03-24
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods Grant 9,287,240 - Li , et al. March 15, 2	2016-03-15
Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods Grant 9,269,700 - Koopmans , et al. February 23, 2	2016-02-23
Stacked Semiconductor Die Assemblies With Improved Thermal Performance And Associated Systems And Methods App 20150279828 - Koopmans; Michel ; et al.	2015-10-01
Thermal Pads Between Stacked Semiconductor Dies And Associated Systems And Methods App 20150221612 - Gandhi; Jaspreet S. ; et al.	2015-08-06
Stacked Semiconductor Die Assemblies With Thermal Spacers And Associated Systems And Methods App 20150170991 - Li; Jian ; et al.	2015-06-18
Methods Of Fabricating Semiconductor Die Assemblies App 20150132869 - England; Luke G. ; et al.	2015-05-14
Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication Grant 8,937,309 - England , et al. January 20, 2	2015-01-20
Semiconductor Die Assemblies And Semiconductor Devices Including Same App 20140353815 - England; Luke G. ; et al.	2014-12-04
Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication Grant 8,828,798 - England , et al. September 9, 2	2014-09-09
Semiconductor Die Assemblies, Semiconductor Devices Including Same, And Methods Of Fabrication App 20140017823 - England; Luke G. ; et al.	2014-01-16
Methods For Forming Semiconductor Device Packages With Photoimageable Dielectric Adhesive Material, And Related Semiconductor Device Packages App 20130299986 - Sun; Yangyang ; et al.	2013-11-14
Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication Grant 8,552,567 - England , et al. October 8, 2	2013-10-08
Semiconductor Die Assemblies, Semiconductor Devices Including Same, And Methods Of Fabrication App 20130037802 - England; Luke G. ; et al.	2013-02-14
Semiconductor Die Assemblies, Semiconductor Devices Including Same, And Methods Of Fabrication App 20130026643 - England; Luke G. ; et al.	2013-01-31
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Grant 7,637,412 - Koopmans December 29, 2	2009-12-29
Apparatus And Method For Depositing And Reflowing Solder Paste On A Microelectronic Workpiece App 20080164298 - Koopmans; Michel	2008-07-10
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Grant 7,347,348 - Koopmans March 25, 2	2008-03-25
System for attaching semiconductor components to substrates App 20060130974 - Koopmans; Michel	2006-06-22
Method for attaching semiconductor components to a substrate using component attach system having radiation exposure assembly Grant 6,943,094 - Koopmans September 13, 2	2005-09-13
Component installation, removal, and replacement apparatus and method Grant 6,911,624 - Koopmans June 28, 2	2005-06-28
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece App 20050092810 - Koopmans, Michel	2005-05-05
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Grant 6,845,901 - Koopmans January 25, 2	2005-01-25
Bumping technology in stacked die configurations Grant 6,847,105 - Koopmans January 25, 2	2005-01-25
Method of fabricating stacked die configurations utilizing redistribution bond pads Grant 6,706,557 - Koopmans March 16, 2	2004-03-16
Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece App 20040035917 - Koopmans, Michel	2004-02-26
Component installation, removal, and replacement apparatus and method App 20040035840 - Koopmans, Michel	2004-02-26
Method and system for attaching semiconductor components to a substrate using local radiation curing of dicing tape App 20030207497 - Koopmans, Michel	2003-11-06
Method for attaching semiconductor components to a substrate using local UV curing of dicing tape Grant 6,589,809 - Koopmans July 8, 2	2003-07-08
Bumping technology in stacked die configurations App 20030057539 - Koopmans, Michel	2003-03-27

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