Koopman; Nicholas G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koopman; Nicholas G..The latest application filed is for "tacking processes and systems for soldering".

Company Profile

0.14.0

Koopman; Nicholas G. - Raleigh NC
Koopman; Nicholas G. - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tacking processes and systems for soldering Grant 5,992,729 - Koopman , et al. November 30, 1	1999-11-30
Fluxless soldering sample pretreating system Grant 5,499,754 - Bobbio , et al. March 19, 1	1996-03-19
Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Grant 5,447,264 - Koopman , et al. September 5, 1	1995-09-05
Fluxless soldering of copper Grant 5,407,121 - Koopman , et al. April 18, 1	1995-04-18
Method of forming differing volume solder bumps Grant 5,381,946 - Koopman , et al. January 17, 1	1995-01-17
Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon Grant 5,374,893 - Koopman , et al. December 20, 1	1994-12-20
Method for testing, burn-in, and/or programming of integrated circuit chips Grant 5,289,631 - Koopman , et al. March 1, 1	1994-03-01
Method of forming dual height solder interconnections Grant 5,251,806 - Agarwala , et al. October 12, 1	1993-10-12
Palladium enhanced soldering and bonding of semiconductor device contacts Grant 5,225,711 - Chang , et al. July 6, 1	1993-07-06
Solder mass having conductive encapsulating arrangement Grant 5,130,779 - Agarwala , et al. July 14, 1	1992-07-14
Palladium enhanced fluxless soldering and bonding of semiconductor device contacts Grant 5,048,744 - Chang , et al. September 17, 1	1991-09-17
Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding Grant 4,463,059 - Bhattacharya , et al. July 31, 1	1984-07-31
Solder mound formation on substrates Grant 4,434,434 - Bhattacharya , et al. February 28, 1	1984-02-28
Process for in-situ modification of solder comopsition Grant 4,332,343 - Koopman , et al. June 1, 1	1982-06-01

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