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Patent applications and USPTO patent grants for Koon; Robert W..The latest application filed is for "metallic mini hooks for joining of metallic and composites".
Patent | Date |
---|---|
Perforated composites for joining of metallic and composite materials Grant 7,624,910 - Barnes , et al. December 1, 2 | 2009-12-01 |
Metallic Mini Hooks For Joining Of Metallic And Composites App 20080003401 - Barnes; John E. ;   et al. | 2008-01-03 |
Perforated Composites For Joining Of Metallic And Composite Materials App 20070241164 - Barnes; John E. ;   et al. | 2007-10-18 |
Enhanced heat transfer in printed circuit boards Grant 5,898,570 - Koon , et al. April 27, 1 | 1999-04-27 |
Method for single filament transverse reinforcement in composite prepreg material Grant 5,873,973 - Koon , et al. February 23, 1 | 1999-02-23 |
Enhanced heat transfer in printed circuit boards and electronic components thereof Grant 5,852,548 - Koon , et al. December 22, 1 | 1998-12-22 |
Enhanced conductive joints from fiber flocking Grant 5,725,707 - Koon , et al. March 10, 1 | 1998-03-10 |
Method for making low cost oriented composite molding compound Grant 5,580,512 - Koon , et al. December 3, 1 | 1996-12-03 |
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