Koon; Eng Meow

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koon; Eng Meow.The latest application filed is for "packaged semiconductor assemblies and methods for manufacturing such assemblies".

Company Profile

0.27.33

Koon; Eng Meow - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged microelectronic components with terminals exposed through encapsulant Grant 8,637,973 - Koon , et al. January 28, 2	2014-01-28
Packaged semiconductor assemblies and methods for manufacturing such assemblies Grant 8,629,054 - Jeung , et al. January 14, 2	2014-01-14
Method for packaging circuits Grant 8,555,495 - Chia , et al. October 15, 2	2013-10-15
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20120241957 - Koon; Eng Meow ; et al.	2012-09-27
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20120241982 - Jeung; Boon Suan ; et al.	2012-09-27
Interconnects For Packaged Semiconductor Devices And Methods For Manufacturing Such Devices App 20120211896 - Jeung; Boon Suan ; et al.	2012-08-23
Apparatus and method for packaging circuits Grant 8,138,617 - Poo , et al. March 20, 2	2012-03-20
Method For Packaging Circuits App 20120064697 - Chia; Yong Poo ; et al.	2012-03-15
Apparatus and method for packaging circuits Grant 8,115,306 - Poo , et al. February 14, 2	2012-02-14
Method for packaging circuits Grant 8,065,792 - Chia , et al. November 29, 2	2011-11-29
Castellation wafer level packaging of integrated circuit chips Grant 8,008,126 - Jeung , et al. August 30, 2	2011-08-30
Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Grant 7,947,529 - Koon , et al. May 24, 2	2011-05-24
Packaged Semiconductor Assemblies And Methods For Manufacturing Such Assemblies App 20110084402 - Jeung; Boon Suan ; et al.	2011-04-14
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20110068454 - Koon; Eng Meow ; et al.	2011-03-24
Method For Packaging Circuits And Packaged Circuits App 20100146780 - Chia; Yong Poo ; et al.	2010-06-17
Apparatus And Method For Packaging Circuits App 20100140794 - Poo; Chia Yong ; et al.	2010-06-10
Method for packaging circuits and packaged circuits Grant 7,712,211 - Chia , et al. May 11, 2	2010-05-11
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20100068851 - Jeung; Boon Suan ; et al.	2010-03-18
Castellation wafer level packaging of integrated circuit chips Grant 7,679,179 - Jeung , et al. March 16, 2	2010-03-16
Apparatus and method for packaging circuits Grant 7,675,169 - Poo , et al. March 9, 2	2010-03-09
Castellation wafer level packaging of integrated circuit chips Grant 7,528,477 - Jeung , et al. May 5, 2	2009-05-05
Microelectronic Die Packages With Leadframes, Including Leadframe-based Interposer For Stacked Die Packages, And Associated Systems And Methods App 20090045489 - Koon; Eng Meow ; et al.	2009-02-19
Microelectronic Die Packages With Metal Leads, Including Metal Leads For Stacked Die Packages, And Associated Systems And Methods App 20090026600 - Koon; Eng Meow ; et al.	2009-01-29
Microelectronic Imagers And Methods For Manufacturing Such Microelectronic Imagers App 20090014822 - Poo; Chia Yong ; et al.	2009-01-15
Interconnects For Packaged Semiconductor Devices And Methods For Manufacturing Such Devices App 20090014859 - Jeung; Boon Suan ; et al.	2009-01-15
Method for fabricating packaged die Grant 7,358,154 - Poo , et al. April 15, 2	2008-04-15
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20080067675 - Jeung; Boon Suan ; et al.	2008-03-20
Packaged Microelectronic Components App 20080067642 - Koon; Eng Meow ; et al.	2008-03-20
Apparatus And Method For Packaging Circuits App 20080054423 - Poo; Chia Y. ; et al.	2008-03-06
Castellation wafer level packaging of integrated circuit chips Grant 7,276,387 - Jeung , et al. October 2, 2	2007-10-02
Semiconductor packages having leadframe-based connection arrays App 20070120247 - Yu; Chan Min ; et al.	2007-05-31
Packaged microelectronic components Grant 7,195,957 - Koon , et al. March 27, 2	2007-03-27
In-process semiconductor packages with leadframe grid arrays Grant 7,170,161 - Yu , et al. January 30, 2	2007-01-30
Flexible ball grid array chip scale packages Grant 7,115,986 - Moon , et al. October 3, 2	2006-10-03
Apparatus and method for packaging circuits App 20060084240 - Poo; Chia Yong ; et al.	2006-04-20
Castellation wafer level packaging of integrated circuit chips App 20060014319 - Jeung; Boon Suan ; et al.	2006-01-19
Castellation wafer level packaging of integrated circuit chips App 20060008946 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060006519 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001142 - Jeung; Boon Suan ; et al.	2006-01-05
Methods for making semiconductor packages with leadframe grid arrays Grant 6,967,127 - Yu , et al. November 22, 2	2005-11-22
Methods for making semiconductor packages with leadframe grid arrays App 20050230808 - Yu, Chan Min ; et al.	2005-10-20
Castellation wafer level packaging of integrated circuit chips Grant 6,949,407 - Jeung , et al. September 27, 2	2005-09-27
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20050130345 - Jeung, Boon Suan ; et al.	2005-06-16
Apparatus and method for packaging circuits Grant 6,894,386 - Poo , et al. May 17, 2	2005-05-17
Castellation wafer level packaging of integrated circuit chips Grant 6,855,572 - Jeung , et al. February 15, 2	2005-02-15
Apparatus and method for packaging circuits App 20050029668 - Poo, Chia Yong ; et al.	2005-02-10
Packaged microelectronic components App 20050026325 - Koon, Eng Meow ; et al.	2005-02-03
Semiconductor packages with leadframe grid arrays and components Grant 6,836,008 - Yu , et al. December 28, 2	2004-12-28
Packaged microelectronic components Grant 6,836,009 - Koon , et al. December 28, 2	2004-12-28
Method for packaging circuits and packaged circuits App 20040221451 - Chia, Yong Poo ; et al.	2004-11-11
Castellation wafer level packaging of integrated circuit chips App 20040043535 - Jeung, Boon Suan ; et al.	2004-03-04
Packaged microelectronic components App 20040026773 - Koon, Eng Meow ; et al.	2004-02-12
Semiconductor packages with leadframe grid arrays and components and methods for making the same App 20030193091 - Yu, Chan Min ; et al.	2003-10-16
Methods for making semiconductor packages with leadframe grid arrays App 20030194837 - Yu, Chan Min ; et al.	2003-10-16
Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture Grant 6,552,910 - Moon , et al. April 22, 2	2003-04-22
Apparatus and method for packaging circuits App 20030067001 - Poo, Chin Yong ; et al.	2003-04-10
Flexible ball grid array chip scale packages and methods of fabrication App 20020164838 - Moon, Ow Chee ; et al.	2002-11-07

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