Koo; Kyung Bum

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koo; Kyung Bum.The latest application filed is for "fin reveal forming sti regions having convex shape between fins".

Company Profile

4.7.14

Koo; Kyung Bum - Albany NY
Koo; Kyung-Bum - Gyeonggi-do KR
Koo; Kyung Bum - Fishkill NY
Koo; Kyung-Bum - Yongin-si N/A KR
Koo; Kyung-Bum - Yongin-shi KR
Koo; Kyung-Bum - Youngin-si KR
Koo; Kyung-Bum - Yongin KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fin reveal forming STI regions having convex shape between fins Grant 10,832,965 - Xu , et al. November 10, 2	2020-11-10
Single-curvature cavity for semiconductor epitaxy Grant 10,355,104 - Qi , et al. July 16, 2	2019-07-16
Fin Reveal Forming Sti Regions Having Convex Shape Between Fins App 20190214308 - Xu; Yiheng ; et al.	2019-07-11
Single-curvature Cavity For Semiconductor Epitaxy App 20190131432 - Qi; Yi ; et al.	2019-05-02
Method for fabricating semiconductor device Grant 9,412,842 - Kim , et al. August 9, 2	2016-08-09
Method For Fabricating Semiconductor Device App 20150011070 - Kim; Jin-Bum ; et al.	2015-01-08
Methods Of Manufacturing Integrated Circuits Having A Compressive Nitride Layer App 20140183720 - Beasor; Scott ; et al.	2014-07-03
Chamber inserts and apparatuses for processing a substrate Grant 8,366,827 - Seo , et al. February 5, 2	2013-02-05
Method for forming an electrical interconnection providing improved surface morphology of tungsten Grant 7,494,917 - Koo February 24, 2	2009-02-24
Method of forming plasma and method of forming a layer using the same App 20070042132 - Seo; Jung-Hun ; et al.	2007-02-22
Chamber inserts and apparatuses for processing a substrate App 20070000109 - Seo; Jung-Hun ; et al.	2007-01-04
Method of manufacturing a capacitor App 20060292810 - Seo; Jung-Hun ; et al.	2006-12-28
Combination of showerhead and temperature control means for controlling the temperature of the showerhead, and deposition apparatus having the same App 20060137607 - Seo; Jung-Hun ; et al.	2006-06-29
Method of depositing a metal compound layer and apparatus for depositing a metal compound layer App 20060128127 - Seo; Jung-Hun ; et al.	2006-06-15
Apparatus and method of forming a layer on a semiconductor substrate App 20060096541 - Seo; Jung-Hun ; et al.	2006-05-11
Method for forming an electrical interconnection providing improved surface morphology of tungsten Grant 6,908,848 - Koo June 21, 2	2005-06-21
Method for forming an electrical interconnection providing improved surface morphology of tungsten App 20050118806 - Koo, Kyung-Bum	2005-06-02
Method for forming an electrical interconnection providing improved surface morphology of tungsten App 20030232496 - Koo, Kyung-Bum	2003-12-18
Method for forming an electrical interconnection providing improved surface morphololgy of tungsten App 20020076924 - Koo, Kyung-Bum	2002-06-20
Method of manufacturing metal pattern of semiconductor device App 20020001945 - Song, Won-Sang ; et al.	2002-01-03

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