KOO; Jung Eun
Patent Applications and Registrations
Patent applications and USPTO patent grants for KOO; Jung Eun.The latest application filed is for "film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut line".
- KOO; Jung Eun - Hwaseong-si KR
| Patent | Date |
|---|---|
| Film Type Package Comprising A Plurality Of Test Pads Disposed On A Plurality Of Margin Areas And Separated From A Plurality Of First Connection Pads By A Cut Line App 20220113577 - HAN; Byung Hun ; et al. | 2022-04-14 |
| Film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut line Grant 11,231,626 - Han , et al. January 25, 2 | 2022-01-25 |
| Semiconductor Package And Electronic Device Including The Same App 20200203311 - KOO; JUNG EUN | 2020-06-25 |
| Film Type Package And Display Apparatus Having The Same App 20190371691 - HAN; Byung Hun ; et al. | 2019-12-05 |
| Semiconductor Packages And Display Devices Including The Same App 20180049324 - Koo; Jung-eun ; et al. | 2018-02-15 |
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