Konno; Yoshito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Konno; Yoshito.The latest application filed is for "semiconductor wafer and method for manufacturing semiconductor device".

Company Profile

0.10.8

Konno; Yoshito - Niiza JP
Konno; Yoshito - Kawasaki N/A JP
Konno; Yoshito - Yokohama JP
Konno; Yoshito - Fukushima-ken JP
Konno, Yoshito - Niiza-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor wafer and method for manufacturing semiconductor device Grant 9,508,559 - Saito , et al. November 29, 2	2016-11-29
Method and apparatus for peeling electronic component Grant 8,991,464 - Konno , et al. March 31, 2	2015-03-31
Method and apparatus for peeling electronic component Grant 8,828,186 - Konno , et al. September 9, 2	2014-09-09
Semiconductor Wafer And Method For Manufacturing Semiconductor Device App 20140110712 - Saito; Shoko ; et al.	2014-04-24
Method for sorting and acquiring semiconductor element, method for producing semiconductor device, and semiconductor device Grant 8,445,906 - Konno , et al. May 21, 2	2013-05-21
Method for fabricating semiconductor device Grant 8,349,624 - Konno January 8, 2	2013-01-08
Method And Apparatus For Peeling Electronic Component App 20120312482 - KONNO; Yoshito ; et al.	2012-12-13
Method For Fabricating Semiconductor Device App 20110097828 - KONNO; Yoshito	2011-04-28
Method For Sorting And Acquiring Semiconductor Element, Method For Producing Semiconductor Device, And Semiconductor Device App 20100117084 - Konno; Yoshito ; et al.	2010-05-13
Method And Apparatus For Peeling Electronic Component App 20090242124 - Konno; Yoshito ; et al.	2009-10-01
Small nonreciprocal circuit element that can be easily wired Grant 6,930,566 - Koseki , et al. August 16, 2	2005-08-16
Probe card and method of testing wafer having a plurality of semiconductor devices Grant 6,774,650 - Maruyama , et al. August 10, 2	2004-08-10
Probe card and method of testing wafer having a plurality of semiconductor devices App 20030160626 - Maruyama, Shigeyuki ; et al.	2003-08-28
Small nonreciprocal circuit element that can be easily wired App 20030128078 - Koseki, Masahiko ; et al.	2003-07-10
Semiconductor chip removing and conveying method and device App 20010049160 - Watanabe, Mitsuhisa ; et al.	2001-12-06

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