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name:-0.046664953231812
name:-0.022987127304077
name:-0.0018918514251709
KONNO; Tomohisa Patent Filings

KONNO; Tomohisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for KONNO; Tomohisa.The latest application filed is for "aqueous dispersion for chemical mechanical polishing, and chemical mechanical polishing method".

Company Profile
0.22.29
  • KONNO; Tomohisa - Minato-ku JP
  • Konno; Tomohisa - Yokkaichi-shi JP
  • Konno; Tomohisa - Yokkaichi N/A JP
  • Konno; Tomohisa - Mie N/A JP
  • Konno; Tomohisa - Mei N/A JP
  • Konno; Tomohisa - Suzuka JP
  • Konno; Tomohisa - Mie-Ken JP
  • Konno; Tomohisa - Tokyo JP
  • Konno; Tomohisa - Chuo-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Aqueous Dispersion For Chemical Mechanical Polishing, And Chemical Mechanical Polishing Method
App 20150344739 - KAMEI; Yasutaka ;   et al.
2015-12-03
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method For Semiconductor Device
App 20140011360 - NAMIE; Yuuji ;   et al.
2014-01-09
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
Grant 8,574,330 - Namie , et al. November 5, 2
2013-11-05
Chemical mechanical planarization with overburden mask
Grant 8,524,606 - Charns , et al. September 3, 2
2013-09-03
Chemical mechanical planarization processes for fabrication of FinFET devices
Grant 8,513,127 - Chang , et al. August 20, 2
2013-08-20
Fabrication of replacement metal gate devices
Grant 8,507,383 - Ando , et al. August 13, 2
2013-08-13
Shallow trench isolation chemical mechanical planarization
Grant 8,497,210 - Charns , et al. July 30, 2
2013-07-30
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method Using Same
App 20130005219 - Takemura; Akihiro ;   et al.
2013-01-03
Chemical Mechanical Planarization Processes For Fabrication of FINFET Devices
App 20120083123 - Chang; Josephine B. ;   et al.
2012-04-05
Chemical Mechanical Planarization With Overburden Mask
App 20120083125 - Charns; Leslie ;   et al.
2012-04-05
Shallow Trench Isolation Chemical Mechanical Planarization
App 20120083122 - Charns; Leslie ;   et al.
2012-04-05
Fabrication of Replacement Metal Gate Devices
App 20120083121 - Ando; Takashi ;   et al.
2012-04-05
Chemical Mechanical Polishing Aqueous Dispersion And Chemical Mechanical Polishing Method For Semiconductor Device
App 20090325383 - Andou; Michiaki ;   et al.
2009-12-31
Aqueous Dispersion For Chemical Mechanical Polishing And Chemical Mechanical Polishing Method For Semiconductor Device
App 20090221213 - Namie; Yuuji ;   et al.
2009-09-03
Electroless Plating Liquid
App 20090088511 - Konno; Tomohisa ;   et al.
2009-04-02
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device
Grant 7,498,294 - Konno , et al. March 3, 2
2009-03-03
Chemical Mechanical Polishing Agent Kit And Chemical Mechanical Polishing Method Using The Same
App 20080274620 - SHIDA; Hirotaka ;   et al.
2008-11-06
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
Grant 7,378,349 - Konno , et al. May 27, 2
2008-05-27
Cleaning Composition, Cleaning Method, And Manufacturing Method Of Semiconductor Device
App 20080045016 - Andou; Michiaki ;   et al.
2008-02-21
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
Grant 7,183,211 - Konno , et al. February 27, 2
2007-02-27
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
App 20060276041 - Uchikura; Kazuhito ;   et al.
2006-12-07
Crosslinked rubber particles and rubber compositions
Grant 6,977,286 - Konno , et al. December 20, 2
2005-12-20
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
App 20050227451 - Konno, Tomohisa ;   et al.
2005-10-13
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device
App 20050176606 - Konno, Tomohisa ;   et al.
2005-08-11
Window member for chemical mechanical polishing and polishing pad
Grant 6,832,949 - Konno , et al. December 21, 2
2004-12-21
Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
App 20040237413 - Shida, Hirotaka ;   et al.
2004-12-02
Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device
App 20040162011 - Konno, Tomohisa ;   et al.
2004-08-19
Crosslinked rubber particles and rubber compositions
App 20040152844 - Konno, Tomohisa ;   et al.
2004-08-05
Crosslinked rubber particles and rubber compositions
Grant 6,747,095 - Konno , et al. June 8, 2
2004-06-08
Methods for producing diene-based rubber/inorganic compound complexes and rubber compositions containing the same
Grant 6,740,704 - Konno , et al. May 25, 2
2004-05-25
Rubber composition
Grant 6,727,307 - Kondo , et al. April 27, 2
2004-04-27
Conjugated diene-based rubber, oil extended rubber and rubber composition containing the same
Grant 6,703,470 - Konno , et al. March 9, 2
2004-03-09
Rubber composition
Grant 6,699,935 - Akema , et al. March 2, 2
2004-03-02
Diene rubber/inorganic compound composite and method for producing the same and rubber composition
App 20040030027 - Konno, Tomohisa ;   et al.
2004-02-12
Rubber compositions
Grant 6,653,404 - Konno , et al. November 25, 2
2003-11-25
Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
App 20030153183 - Konno, Tomohisa ;   et al.
2003-08-14
Window member for chemical mechanical polishing and polishing pad
App 20030129931 - Konno, Tomohisa ;   et al.
2003-07-10
Rubber composition
App 20030125467 - Akema, Hiroshi ;   et al.
2003-07-03
Rubber compositions
Grant 6,559,219 - Tadaki , et al. May 6, 2
2003-05-06
Rubber compositions
App 20030008954 - Tadaki, Toshihiro ;   et al.
2003-01-09
Rubber composition
App 20020156169 - Kondo, Hajime ;   et al.
2002-10-24
Methods for producing diene-based rubber/inorganic compound complexes and rubber compositions containing the same
App 20020111418 - Konno, Tomohisa ;   et al.
2002-08-15
Conjugated diene-based rubber and method of producing the same, oil extended rubber and rubber composition containing the same
App 20020052435 - Konno, Tomohisa ;   et al.
2002-05-02
Conjugated diene-based rubber, oil extended rubber and rubber composition containing the same
App 20020045691 - Konno, Tomohisa ;   et al.
2002-04-18
Crosslinked rubber particles and rubber compositions
App 20020007011 - Konno, Tomohisa ;   et al.
2002-01-17
Rubber compositions
App 20010053813 - Konno, Tomohisa ;   et al.
2001-12-20

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