Konno; Takafumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Konno; Takafumi.The latest application filed is for "non-transitory computer-readable storage medium for storing information presentation program, information presentation device, and information presentation method".

Company Profile

1.14.19

Konno; Takafumi - Nagoya JP
KONNO; Takafumi - Saijo-shi JP
Konno; Takafumi - Saijo JP
Konno; Takafumi - Hokkaido JP
Konno; Takafumi - Nanae JP
Konno; Takafumi - Hakodate JP
Konno, Takafumi - Hakodate-shi JP
Konno, Takafumi - Hakodat-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-transitory computer-readable storage medium storing information presentation program, information presentation device, and information presentation method of controlling to display information regarding trouble shooting Grant 11,429,646 - Kotani , et al. August 30, 2	2022-08-30
Non-transitory Computer-readable Storage Medium For Storing Information Presentation Program, Information Presentation Device, And Information Presentation Method App 20210240743 - Kotani; Ichiro ; et al.	2021-08-05
Thermoplastic Liquid Crystal Polymer And Film Of Same App 20200017769 - KONNO; Takafumi ; et al.	2020-01-16
Thermoplastic liquid crystal polymer film, and laminate and circuit board using same Grant 9,538,646 - Onodera , et al. January 3, 2	2017-01-03
Thermoplastic Liquid Crystal Polymer Film And Method For Producing Same App 20150017413 - KONNO; Takafumi ; et al.	2015-01-15
Thermoplastic Liquid Crystal Polymer Film, And Laminate And Circuit Board Using Same App 20140231123 - ONODERA; Minoru ; et al.	2014-08-21
Semiconductor device and manufacturing method therefor Grant 8,466,540 - Tanaka , et al. June 18, 2	2013-06-18
Semiconductor Device and Manufacturing Method Therefor App 20100193923 - Tanaka; Shigeki ; et al.	2010-08-05
Lead frame and semiconductor device using the lead frame and method of manufacturing the same Grant 6,909,179 - Tanaka , et al. June 21, 2	2005-06-21
Method of manufacturing semiconductor package including forming a resin sealing member Grant 6,887,739 - Fujisawa , et al. May 3, 2	2005-05-03
Semiconductor device App 20040262752 - Ito, Fujio ; et al.	2004-12-30
Semiconductor device Grant 6,803,258 - Ito , et al. October 12, 2	2004-10-12
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Grant 6,764,878 - Fujisawa , et al. July 20, 2	2004-07-20
Method of manufacturing semiconductor device having resin sealing body Grant 6,759,279 - Fujisawa , et al. July 6, 2	2004-07-06
Semiconductor device App 20040126932 - Ito, Fujio ; et al.	2004-07-01
Method of manufacturing semiconductor device App 20040005733 - Fujisawa, Atsushi ; et al.	2004-01-08
Method of making semiconductor device having improved heat radiation plate arrangement Grant 6,673,655 - Ito , et al. January 6, 2	2004-01-06
Semiconductor device and method of manufacturing the same Grant 6,551,862 - Oota , et al. April 22, 2	2003-04-22
Method of manufacturing semiconductor device App 20020192872 - Fujisawa, Atsushi ; et al.	2002-12-19
Semiconductor device App 20020192871 - Ito, Fujio ; et al.	2002-12-19
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate App 20020182776 - Fujisawa, Atsushi ; et al.	2002-12-05
Ball grid array type semiconductor package having a flexible substrate Grant 6,476,466 - Fujisawa , et al. November 5, 2	2002-11-05
Semiconductor device App 20020137261 - Ito, Fujio ; et al.	2002-09-26
Semiconductor device App 20020137262 - Ito, Fujio ; et al.	2002-09-26
Method of manufacturing a semiconductor device Grant 6,448,111 - Fujisawa , et al. September 10, 2	2002-09-10
Ball grid array type semiconductor package having a flexible substrate App 20020079579 - Fujisawa, Atsushi ; et al.	2002-06-27
Ball grid array type semiconductor package having a flexible substrate App 20020070462 - Fujisawa, Atsushi ; et al.	2002-06-13
Semiconductor device and method of manufacturing the same App 20020050642 - Oota, Riyouichi ; et al.	2002-05-02
Lead frame and semiconductor device using the lead frame and method of manufacturing the same App 20010050419 - Tanaka, Shigeki ; et al.	2001-12-13
Semiconductor device and its manufacturing method App 20010015489 - Fujisawa, Atsushi ; et al.	2001-08-23
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting Grant 6,232,650 - Fujisawa , et al. May 15, 2	2001-05-15

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