Konno; Kaoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Konno; Kaoru.The latest application filed is for "electrolytic solution and electrochemical device".

Company Profile

4.9.11

Konno; Kaoru - Tokyo JP
KONNO; Kaoru - Chiyoda-ku Tokyo
Konno; Kaoru - Tsukuba JP
Konno; Kaoru - Tsukuba-shi JP
Konno; Kaoru - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrolytic solution and electrochemical device Grant 11,444,325 - Konno , et al. September 13, 2	2022-09-13
Electrolytic solution and electrochemical device Grant 11,411,250 - Konno , et al. August 9, 2	2022-08-09
Electrolytic solution and electrochemical device Grant 11,398,643 - Konno , et al. July 26, 2	2022-07-26
Lithium ion secondary battery including aluminum silicate Grant 11,031,600 - Konno , et al. June 8, 2	2021-06-08
Electrolytic Solution And Electrochemical Device App 20200168952 - KONNO; Kaoru ; et al.	2020-05-28
Electrolytic Solution And Electrochemical Device App 20200152398 - KONNO; Kaoru ; et al.	2020-05-14
Electrolytic Solution And Electrochemical Device App 20200119399 - KONNO; Kaoru ; et al.	2020-04-16
Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition Grant 10,504,864 - Konno , et al. Dec	2019-12-10
Lithium Ion Secondary Battery App 20180006309 - KONNO; Kaoru ; et al.	2018-01-04
Adhesive Composition, Electronic-component-mounted Substrate And App 20160093584 - Konno; Kaoru ; et al.	2016-03-31
Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition Grant 9,247,652 - Konno , et al. January 26, 2	2016-01-26
Adhesive Composition And Semiconductor Device Using Same App 20130302603 - Konno; Kaoru ; et al.	2013-11-14
Adhesive Composition And Semiconductor Device Using The Same App 20130183535 - Konno; Kaoru ; et al.	2013-07-18
Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material Grant 8,421,247 - Hayashi , et al. April 16, 2	2013-04-16
Connecting Material And Semiconductor Device App 20110101543 - Hayashi; Hiroki ; et al.	2011-05-05
Adhesive Composition, Electronic-component-mounted Substrate And Semiconductor Device Using The Adhesive Composition App 20100221559 - Konno; Kaoru ; et al.	2010-09-02

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