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Konnik; Robert Patent Filings

Konnik; Robert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Konnik; Robert.The latest application filed is for "high-temperature cable having a fiber-reinforced resin layer and related methods".

Company Profile
0.4.5
  • Konnik; Robert - South Windsor CT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of making a high-temperature cable having a fiber-reinforced rein layer
Grant 9,747,355 - Masakowski , et al. August 29, 2
2017-08-29
High-temperature cable having inorganic material
Grant 9,543,060 - Konnik January 10, 2
2017-01-10
High-Temperature Cable Having A Fiber-Reinforced Resin Layer and Related Methods
App 20140000929 - Masakowski; Daniel D. ;   et al.
2014-01-02
High-Temperature Cable having Inorganic Material
App 20130133918 - Konnik; Robert
2013-05-30
Method and System for a Down-hole Cable having a Liquid Bonding Material
App 20110253408 - Magner; Scott R. ;   et al.
2011-10-20
Fire resistant cable
Grant 7,538,275 - Konnik , et al. May 26, 2
2009-05-26
Fire resistant electrical cable splice
Grant 7,339,115 - Konnik March 4, 2
2008-03-04
Fire resistant electrical cable splice
App 20070012470 - Konnik; Robert
2007-01-18
Fire resistant cable
App 20060175075 - Konnik; Robert ;   et al.
2006-08-10

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