Konishi; Toshiharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Konishi; Toshiharu.The latest application filed is for "structure having a characteristic of conducting or absorbing electromagnetic waves".

Company Profile

0.8.1

Konishi; Toshiharu - Ibaraki-shi JP
Konishi; Toshiharu - Ibaraki JP
Konishi; Toshiharu - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure having a characteristic of conducting or absorbing electromagnetic waves App 20060093782 - Sano; Masanori ; et al.	2006-05-04
Resonance circuit tag, method for production thereof and method for changing resonance characteristic thereof Grant 6,072,394 - Hasegawa , et al. June 6, 2	2000-06-06
Water-soluble or water-dispersible pressure-sensitive adhesive tape Grant 5,439,748 - Nakamura , et al. August 8, 1	1995-08-08
Double-coated adhesive tape Grant 4,844,973 - Konishi , et al. July 4, 1	1989-07-04
Process for fixing metal powder molding at sintering Grant 4,797,251 - Sakuramoto , et al. January 10, 1	1989-01-10
Composite release sheet material Grant 4,741,948 - Konishi , et al. May 3, 1	1988-05-03
Process for fixing alloy powder molding at sintering Grant 4,681,733 - Konishi , et al. July 21, 1	1987-07-21
Composition for bonding metal powders comprising alkyl (meth)acrylates polymers having 3-12 carbon atoms in the alkyl substituent and a Tg -70.degree. to -10.degree. C. for the polymers Grant 4,596,841 - Konishi , et al. June 24, 1	1986-06-24
Electrically conductive adhesive tape Grant 4,456,652 - Konishi , et al. June 26, 1	1984-06-26

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