KONISHI; Hidekazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for KONISHI; Hidekazu.The latest application filed is for "extrusion molding hydraulic composition, method for manufacturing extrusion-molded body, and extrusion-molded body".
- KONISHI; Hidekazu - Joetsu-shi JP
- Konishi; Hidekazu - Joetsu JP
- Konishi; Hidekazu - Aichi JP
- Konishi; Hidekazu - Ibaraki JP
| Patent | Date |
|---|---|
| Extrusion Molding Hydraulic Composition, Method For Manufacturing Extrusion-molded Body, And Extrusion-molded Body App 20210253860 - KONISHI; Hidekazu | 2021-08-19 |
| Thickeners and hydraulic compositions Grant 10,858,287 - Saito , et al. December 8, 2 | 2020-12-08 |
| Hydraulic composition Grant 10,294,158 - Yamakawa , et al. | 2019-05-21 |
| Thickeners And Hydraulic Compositions App 20190127276 - SAITO; Hironao ; et al. | 2019-05-02 |
| Cement mortar composition Grant 10,047,009 - Konishi , et al. August 14, 2 | 2018-08-14 |
| Concrete composition and making method Grant 10,035,728 - Konishi , et al. July 31, 2 | 2018-07-31 |
| Hydraulic Composition App 20180208507 - YAMAKAWA; Tsutomu ; et al. | 2018-07-26 |
| Concrete Composition And Making Method App 20180118619 - KONISHI; Hidekazu ; et al. | 2018-05-03 |
| Cement Mortar Composition App 20170260094 - KONISHI; Hidekazu ; et al. | 2017-09-14 |
| Concrete composition Grant 9,469,570 - Konishi , et al. October 18, 2 | 2016-10-18 |
| Concrete Composition App 20150315080 - Konishi; Hidekazu ; et al. | 2015-11-05 |
| Self-leveling Composition App 20140345498 - KONISHI; Hidekazu ; et al. | 2014-11-27 |
| Anthracene derivative, compound obtained therefrom, composition, cured product, and process for producing same Grant 8,895,632 - Hyodo , et al. November 25, 2 | 2014-11-25 |
| Extrusion molding hydraulic composition Grant 8,652,252 - Konishi , et al. February 18, 2 | 2014-02-18 |
| Extrusion Molding Hydraulic Composition App 20140018477 - KONISHI; Hidekazu ; et al. | 2014-01-16 |
| Anthracene Derivative, Compound Obtained Therefrom, Composition,cured Product, And Process For Producing Same App 20120232240 - Hyodo; Hiroyuki ; et al. | 2012-09-13 |
| Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device Grant 5,299,729 - Matsushita , et al. * April 5, 1 | 1994-04-05 |
| Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device Grant 5,172,851 - Matsushita , et al. December 22, 1 | 1992-12-22 |
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