Koning; Paul A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koning; Paul A..The latest application filed is for "polymer matrices for polymer solder hybrid materials".

Company Profile

0.42.48

Koning; Paul A. - Chandler AZ
Koning; Paul A. - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polymer matrices for polymer solder hybrid materials Grant 9,247,686 - Jayaraman , et al. January 26, 2	2016-01-26
Polymer Matrices For Polymer Solder Hybrid Materials App 20140182763 - JAYARAMAN; Saikumar ; et al.	2014-07-03
Polymer matrices for polymer solder hybrid materials Grant 8,703,286 - Jayaraman , et al. April 22, 2	2014-04-22
Semiconductor wafer coat layers and methods therefor Grant 8,193,072 - Li , et al. June 5, 2	2012-06-05
Nanotube modified solder thermal intermediate structure, systems, and methods Grant 8,129,223 - Koning , et al. March 6, 2	2012-03-06
Polymer Matrices For Polymer Solder Hybrid Materials App 20110194254 - Jayaraman; Saikumar ; et al.	2011-08-11
Thermal intermediate apparatus, systems, and methods Grant 7,985,627 - White , et al. July 26, 2	2011-07-26
Nanotube Modified Solder Thermal Intermediate Structure, Systems, And Methods App 20110168763 - Koning; Paul A. ; et al.	2011-07-14
Polymer matrices for polymer solder hybrid materials Grant 7,967,942 - Jayaraman , et al. June 28, 2	2011-06-28
Phase change material containing fusible particles as thermally conductive filler Grant 7,960,019 - Jayaraman , et al. June 14, 2	2011-06-14
Semiconductor Wafer Coat Layers And Methods Therefor App 20110059596 - Li; Eric J. ; et al.	2011-03-10
Semiconductor wafer coat layers and methods therefor Grant 7,897,486 - Li , et al. March 1, 2	2011-03-01
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Grant 7,846,778 - Rumer , et al. December 7, 2	2010-12-07
Component packaging apparatus, systems, and methods Grant 7,816,171 - Koning , et al. October 19, 2	2010-10-19
No-flow underfill composition and method Grant 7,619,318 - Rumer , et al. November 17, 2	2009-11-17
Carbon-carbon and/or metal-carbon fiber composite heat spreader Grant 7,534,650 - Houle , et al. May 19, 2	2009-05-19
Thermal Intermediate Apparatus, Systems, And Methods App 20090075430 - White; Bryan M. ; et al.	2009-03-19
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Grant 7,473,995 - Rumer , et al. January 6, 2	2009-01-06
Thermal intermediate apparatus, systems, and methods Grant 7,456,052 - White , et al. November 25, 2	2008-11-25
Microelectronic package, method of manufacturing same, and system including same App 20080237841 - Arana; Leonel R. ; et al.	2008-10-02
Phase change thermal interface materials including polyester resin Grant 7,408,787 - Matayabas, Jr. , et al. August 5, 2	2008-08-05
Component packaging apparatus, systems, and methods Grant 7,365,414 - Koning , et al. April 29, 2	2008-04-29
Solder Bumps Formation Using Solder Paste With Shape Retaining Attribute App 20080092991 - Martin; Edward L. ; et al.	2008-04-24
Solder bumps formation using solder paste with shape retaining attribute Grant 7,331,500 - Martin , et al. February 19, 2	2008-02-19
Thermal interface material and electronic assembly having such a thermal interface material Grant 7,311,967 - Dani , et al. December 25, 2	2007-12-25
Phase change material containing fusible particles as thermally conductive filler App 20070287005 - Jayaraman; Saikumar ; et al.	2007-12-13
Solder flux composition App 20070284412 - Prakash; Anna M. ; et al.	2007-12-13
Phase change material containing fusible particles as thermally conductive filler Grant 7,294,394 - Jayaraman , et al. November 13, 2	2007-11-13
Polymer matrices for polymer solder hybrid materials App 20070251639 - Jayaraman; Saikumar ; et al.	2007-11-01
Semiconductor wafer coat layers and methods therefor Grant 7,279,362 - Li , et al. October 9, 2	2007-10-09
Semiconductor wafer coat layers and methods therefor App 20070218652 - Li; Eric J. ; et al.	2007-09-20
Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor App 20070182010 - Koning; Paul A.	2007-08-09
Polymer matrices for polymer solder hybrid materials Grant 7,252,877 - Jayaraman , et al. August 7, 2	2007-08-07
Negative thermal expansion material filler for low CTE composites App 20070135550 - Chakrapani; Nirupama ; et al.	2007-06-14
Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor Grant 7,229,933 - Koning June 12, 2	2007-06-12
Thermal Interface Apparatus, Systems, And Methods App 20070119582 - Zhang; Yuegang ; et al.	2007-05-31
Carbon-carbon and/or metal-carbon fiber composite heat spreader App 20070111383 - Houle; Sabina J. ; et al.	2007-05-17
Carbon-carbon and/or metal-carbon fiber composite heat spreaders Grant 7,195,951 - Houle , et al. March 27, 2	2007-03-27
Nanotube modified solder thermal intermediate structure, systems, and methods Grant 7,180,174 - Koning , et al. February 20, 2	2007-02-20
Semi-solid metal injection methods for electronic assembly thermal interface Grant 7,169,650 - Rinella , et al. January 30, 2	2007-01-30
Thermal interface apparatus, systems, and methods Grant 7,168,484 - Zhang , et al. January 30, 2	2007-01-30
Polymeric dielectric material for high-energy density capacitors Grant 7,136,275 - Koning , et al. November 14, 2	2006-11-14
Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist Grant 7,126,215 - Koning , et al. October 24, 2	2006-10-24
Semiconductor wafer coat layers and methods therefor App 20060223284 - Li; Eric J. ; et al.	2006-10-05
Polymer with solder pre-coated fillers for thermal interface materials Grant 7,036,573 - Koning , et al. May 2, 2	2006-05-02
No-flow underfill composition and method App 20060025500 - Rumer; Christopher L. ; et al.	2006-02-02
Thermoelectric cooling for microelectronic packages and dice Grant 6,981,380 - Chrysler , et al. January 3, 2	2006-01-03
No-flow underfill composition and method Grant 6,982,492 - Rumer , et al. January 3, 2	2006-01-03
Solder bumps formation using solder paste with shape retaining attribute App 20050284920 - Martin, Edward L. ; et al.	2005-12-29
Enhancing epoxy strength using kaolin filler App 20050287714 - Walk, Michael ; et al.	2005-12-29
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Grant 6,974,723 - Matayabas, Jr. , et al. December 13, 2	2005-12-13
Substrate imprinting techniques App 20050260790 - Goodner, Michael D. ; et al.	2005-11-24
Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist App 20050221605 - Koning, Paul A. ; et al.	2005-10-06
Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor App 20050221597 - Koning, Paul A.	2005-10-06
Phase change material containing fusible particles as thermally conductive filler App 20050214523 - Jayaraman, Saikumar ; et al.	2005-09-29
Phase change material containing fusible particles as thermally conductive filler Grant 6,926,955 - Jayaraman , et al. August 9, 2	2005-08-09
Phase change thermal interface materials including exfoliated clay Grant 6,924,027 - Matayabas, Jr. , et al. August 2, 2	2005-08-02
Thermal intermediate apparatus, systems, and methods App 20050139991 - White, Bryan M. ; et al.	2005-06-30
Nanotube modified solder thermal intermediate structure, systems, and methods App 20050139642 - Koning, Paul A. ; et al.	2005-06-30
Component packaging apparatus, systems, and methods App 20050116299 - Koning, Paul A. ; et al.	2005-06-02
Component packaging apparatus, systems, and methods App 20050116387 - Davison, Peter A. ; et al.	2005-06-02
Carbon-carbon and/or metal-carbon fiber composite heat spreaders App 20050104197 - Houle, Sabina J. ; et al.	2005-05-19
No-flow underfill composition and method App 20050087891 - Rumer, Christopher L. ; et al.	2005-04-28
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials App 20050040507 - Matayabas, James C. JR. ; et al.	2005-02-24
Phase change thermal interface materials including polyester resin App 20050041406 - Matayabas, James Christopher JR. ; et al.	2005-02-24
Semi-solid metal injection methods and apparatus for electronic assembly thermal interface App 20050006757 - Rinella, Agostino C. ; et al.	2005-01-13
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Grant 6,841,867 - Matayabas, Jr. , et al. January 11, 2	2005-01-11
Carbon-carbon and/or metal-carbon fiber composite heat spreaders Grant 6,837,306 - Houle , et al. January 4, 2	2005-01-04
Thermal interface apparatus, systems, and methods App 20040261987 - Zhang, Yuegang ; et al.	2004-12-30
Polymer solder hybrid Grant 6,813,153 - Koning , et al. November 2, 2	2004-11-02
Phase change thermal interface materials including exfoliated clay App 20040191503 - Matayabas, James Christopher JR. ; et al.	2004-09-30
Electronic assemblies with solidified thixotropic thermal interface material Grant 6,787,899 - Rinella , et al. September 7, 2	2004-09-07
Polymer matrices for polymer solder hybrid materials App 20040151885 - Jayaraman, Saikumar ; et al.	2004-08-05
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials App 20040124526 - Matayabas, James C. JR. ; et al.	2004-07-01
Thermoelectric cooling for microelectronic packages and dice App 20040118129 - Chrysler, Gregory M. ; et al.	2004-06-24
Polymer solder hybrid App 20040052050 - Koning, Paul A. ; et al.	2004-03-18
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly App 20030178730 - Rumer, Christopher L. ; et al.	2003-09-25
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly App 20030178720 - Rumer, Christopher L. ; et al.	2003-09-25
Semi-solid metal injection methods and apparatus for electronic assembly thermal interface App 20030173051 - Rinella, Agostino C. ; et al.	2003-09-18
Thermal interface material and method of fabricating the same App 20030168731 - Matayabas, James Christopher JR. ; et al.	2003-09-11
Polymer with solder pre-coated fillers for thermal interface materials App 20030150604 - Koning, Paul A. ; et al.	2003-08-14
Phase change material containing fusible particles as thermally conductive filler App 20030153667 - Jayaraman, Saikumar ; et al.	2003-08-14
Thermal interface material and electronic assembly having such a thermal interface material App 20030077478 - Dani, Ashay A. ; et al.	2003-04-24
Polymeric dielectric material for high-energy density capacitors App 20030011960 - Koning, Paul A. ; et al.	2003-01-16
Polymeric dielectric material for high-energy density capacitors Grant 6,480,370 - Koning , et al. November 12, 2	2002-11-12
Carbon-carbon and/or metal-carbon fiber composite heat spreader Grant 6,469,381 - Houle , et al. October 22, 2	2002-10-22
Carbon-carbon and/or metal-carbon fiber composite heat spreaders App 20020038704 - Houle, Sabina J. ; et al.	2002-04-04
Filled solder Grant 6,365,973 - Koning April 2, 2	2002-04-02

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