Koning; Paul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Koning; Paul.The latest application filed is for "microelectronic device having liquid crystalline epoxy resins".
- Koning; Paul - Holland MI
- Koning; Paul - Chandler AZ
- Koning; Paul - Chander AZ
| Patent | Date |
|---|---|
| Table foot Grant D944,045 - Koning February 22, 2 | 2022-02-22 |
| Table foot Grant D920,727 - Koning June 1, 2 | 2021-06-01 |
| Microelectronic device having liquid crystalline epoxy resins Grant 7,794,623 - Matayabas, Jr. , et al. September 14, 2 | 2010-09-14 |
| Wafer-level underfill process making use of sacrificial contact pad protective material Grant 7,530,164 - Koning , et al. May 12, 2 | 2009-05-12 |
| Microelectronic device having liquid crystalline epoxy resins App 20080237897 - Matayabas; James Christopher ; et al. | 2008-10-02 |
| Liquid crystalline epoxy resins Grant 7,417,111 - Matayabas, Jr. , et al. August 26, 2 | 2008-08-26 |
| Latch Assembly With Remote Release App 20080178778 - Koning; Paul ; et al. | 2008-07-31 |
| Table foot Grant D569,663 - Pearsons , et al. May 27, 2 | 2008-05-27 |
| Table foot Grant D569,136 - Pearsons , et al. May 20, 2 | 2008-05-20 |
| Folding leg latch assembly Grant 7,350,469 - Koning , et al. April 1, 2 | 2008-04-01 |
| Component Packaging Apparatus, Systems, And Methods App 20080023817 - Koning; Paul ; et al. | 2008-01-31 |
| Table foot Grant D555,945 - Pearsons , et al. November 27, 2 | 2007-11-27 |
| Wafer-level underfill process making use of sacrificial contact pad protective material Grant 7,059,048 - Koning , et al. June 13, 2 | 2006-06-13 |
| Wafer-level underfill process making use of sacrificial contact pad protective material App 20060121646 - Koning; Paul ; et al. | 2006-06-08 |
| Folding leg latch assembly App 20050235886 - Koning, Paul ; et al. | 2005-10-27 |
| Liquid crystalline epoxy resins App 20050224753 - Matayabas, James Christopher JR. ; et al. | 2005-10-13 |
| Dielectric with fluorescent material App 20050123860 - Koning, Paul ; et al. | 2005-06-09 |
| Wafer-level underfill process and device for cpu and non-cpu applications App 20030226254 - Koning, Paul ; et al. | 2003-12-11 |
| Electronic packages having good reliability comprising low modulus thermal interface materials Grant 6,597,575 - Matayabas, Jr. , et al. July 22, 2 | 2003-07-22 |
| Electronic Packages Having Good Reliability Comprising Low Modulus Thermal Interface Materials App 20030128521 - Matayabas, James C. JR. ; et al. | 2003-07-10 |
| Protective film for the fabrication of direct build-up layers on an encapsulated die package App 20030068852 - Towle, Steven ; et al. | 2003-04-10 |
| Protective film for the fabrication of direct build-up layers on an encapsulated die package Grant 6,489,185 - Towle , et al. December 3, 2 | 2002-12-03 |
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