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Semiconductor Packages App 20210343617 - KIM; Ji Hwang ;   et al. | 2021-11-04 |
Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure Grant 11,069,592 - Kim , et al. July 20, 2 | 2021-07-20 |
Semiconductor package and method of manufacturing the same Grant 10,964,618 - Lee , et al. March 30, 2 | 2021-03-30 |
Semiconductor Packages App 20200194331 - KIM; Ji Hwang ;   et al. | 2020-06-18 |
Semiconductor Package And Method Of Manufacturing The Same App 20200168522 - Lee; Jang-woo ;   et al. | 2020-05-28 |
Package for processing sensed-data, sensed-data processor, and system for processing sensed-data Grant 10,105,102 - Umemoto , et al. October 23, 2 | 2018-10-23 |
Package For Processing Sensed-data, Sensed-data Processor, And System For Processing Sensed-data App 20160051197 - UMEMOTO; Mitsuo ;   et al. | 2016-02-25 |
Camera module and method of manufacturing the camera module Grant 8,927,316 - Cho , et al. January 6, 2 | 2015-01-06 |
Image sensor module having image sensor package Grant 8,902,356 - Seo , et al. December 2, 2 | 2014-12-02 |
Camera Module And Method Of Manufacturing The Camera Module App 20140073079 - Cho; Yong-Hoe ;   et al. | 2014-03-13 |
Camera module and method of manufacturing the camera module Grant 8,547,471 - Cho , et al. October 1, 2 | 2013-10-01 |
Image sensor module, method of manufacturing the same, camera module including the same and electronic device including the camera module Grant 8,203,130 - Kong June 19, 2 | 2012-06-19 |
Photographic Modules And Methods Of Forming The Same App 20120105706 - KONG; Yung-Cheol | 2012-05-03 |
Camera module Grant 8,139,145 - Ryu , et al. March 20, 2 | 2012-03-20 |
Camera Module App 20120038813 - JUNG; Young-Gyu ;   et al. | 2012-02-16 |
Image Sensor Module, Method Of Manufacturing The Same, Camera Module Including The Same And Electronic Device Including The Camera Module App 20120009718 - KONG; Yung-Cheol | 2012-01-12 |
Camera Module And Method Of Manufacturing The Camera Module App 20110285889 - Cho; Yong-Hoe ;   et al. | 2011-11-24 |
Image sensor module, camera module including the same and electronic device including the camera module Grant 8,053,714 - Kong November 8, 2 | 2011-11-08 |
Image Sensor Module Having Image Sensor Package App 20110267535 - Seo; Byoung-Rim ;   et al. | 2011-11-03 |
Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips Grant 7,972,889 - Kong July 5, 2 | 2011-07-05 |
Image sensor package and method of manufacturing the same Grant 7,863,702 - Seo , et al. January 4, 2 | 2011-01-04 |
Photographic Modules And Methods Of Forming The Same App 20100129954 - KONG; Yung-Cheol | 2010-05-27 |
Camera module and method of fabricating the same App 20090253226 - Kong; Yung-cheol | 2009-10-08 |
Image Sensor Module, Camera Module Including The Same And Electronic Device Including The Camera Module App 20090194668 - KONG; Yung-Cheol | 2009-08-06 |
Camera module and method of fabricating the same Grant 7,550,812 - Kong June 23, 2 | 2009-06-23 |
Camera Module App 20090115891 - RYU; Han-Sung ;   et al. | 2009-05-07 |
Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure Grant 7,494,292 - Kong , et al. February 24, 2 | 2009-02-24 |
Image sensor camera module and method of fabricating the same Grant 7,484,901 - Seo , et al. February 3, 2 | 2009-02-03 |
Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens Grant 7,379,113 - Kong , et al. May 27, 2 | 2008-05-27 |
Camera module and method of fabricating the same App 20080073734 - Kong; Yung-cheol | 2008-03-27 |
Image sensor camera module and method of fabricating the same App 20060028573 - Seo; Byoung-Rim ;   et al. | 2006-02-09 |
Image sensor package and method of manufacturing the same App 20060006486 - Seo; Byoung-Rim ;   et al. | 2006-01-12 |
Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure App 20050285016 - Kong, Yung-Cheol ;   et al. | 2005-12-29 |
Chip package, image sensor module including chip package, and manufacturing method thereof App 20050258502 - Kong, Yung-Cheol ;   et al. | 2005-11-24 |
Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens App 20050237415 - Kong, Yung-Cheol ;   et al. | 2005-10-27 |