loadpatents
name:-0.024283885955811
name:-0.012009859085083
name:-0.0046300888061523
Kong; Shengqian Patent Filings

Kong; Shengqian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kong; Shengqian.The latest application filed is for "debondable compositions".

Company Profile
4.10.19
  • Kong; Shengqian - Hillsborough NJ
  • Kong; Shengqian - Edison NJ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Reactive resins and formulations for low refractive index and low dielectric constant applications
Grant 10,392,543 - Issari , et al. A
2019-08-27
Debondable Compositions
App 20190169478 - KONG; Shengqian ;   et al.
2019-06-06
1K UV and thermal cure high temperature debondable adhesive
Grant 10,280,349 - Hynes , et al.
2019-05-07
Reactive Resins and Formulations for Low Refractive Index and Low Dielectric Constant Applications
App 20190071593 - Issari; Bahram ;   et al.
2019-03-07
High temperature debondable adhesive
Grant 9,850,409 - Zhang , et al. December 26, 2
2017-12-26
1k Uv And Thermal Cure High Temperature Debondable Adhesive
App 20170081574 - Hynes; Stephen ;   et al.
2017-03-23
Vinyl carbosiloxane resins
Grant 9,556,313 - Kong , et al. January 31, 2
2017-01-31
High Temperature Debondable Adhesive
App 20160068720 - Zhang; Wenhua ;   et al.
2016-03-10
Vinyl Carbosiloxane Resins
App 20150087791 - Kong; Shengqian ;   et al.
2015-03-26
Radiation curable temporary laminating adhesive for use in high temperature applications
Grant 8,921,443 - Herr , et al. December 30, 2
2014-12-30
Oxetane-containing Compounds And Compositions Thereof
App 20140264165 - Liu; Puwei ;   et al.
2014-09-18
Oxetane-containing Compounds And Compositions Thereof
App 20140209951 - Kong; Shengqian ;   et al.
2014-07-31
Wafer backside coating process with pulsed UV light source
Grant 8,791,033 - Gasa , et al. July 29, 2
2014-07-29
Radiation Curable Temporary Laminating Adhesive For Use In High Temperature Applications
App 20140011904 - Herr; Donald E. ;   et al.
2014-01-09
Wafer Backside Coating Process With Pulsed Uv Light Source
App 20130099396 - Gasa; Jeffrey ;   et al.
2013-04-25
Wafer Backside Coating Containing Reactive Sulfur Compound
App 20130101856 - Hajela; Sharad ;   et al.
2013-04-25
Radiation or thermally curable barrier sealants
Grant 8,278,401 - Kong , et al. October 2, 2
2012-10-02
Composition of cationic initiator and oxetane compound
Grant 7,902,305 - Kong March 8, 2
2011-03-08
Barrier sealant of phenylene oxetane and cationic initiator
Grant 7,887,716 - Kong , et al. February 15, 2
2011-02-15
Radiation- Or Thermally-curable Barrier Sealants
App 20100164368 - Kong; Shengqian ;   et al.
2010-07-01
Thermally Curable Epoxy-amine Barrier Sealants
App 20100168279 - Kong; Shengqian ;   et al.
2010-07-01
Radiation-or Thermally-curable Oxetane Barrier Sealants
App 20080296159 - Kong; Shengqian ;   et al.
2008-12-04
Radiation-or Thermally-curable Oxetane Barrier Sealants
App 20080272328 - KONG; SHENGQIAN
2008-11-06
Radiation curable cycloaliphatic barrier sealants
App 20070117917 - Herr; Donald E. ;   et al.
2007-05-24
Radiation- or thermally-curable oxetane barrier sealants
App 20070034515 - Kong; Shengqian ;   et al.
2007-02-15
Radiation- or thermally-curable oxetane barrier sealants
App 20060223978 - Kong; Shengqian
2006-10-05
Radiation curable cycloaliphatic barrier sealants
App 20060223937 - Herr; Donald E. ;   et al.
2006-10-05

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