Kong; Bob

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kong; Bob.The latest application filed is for "electroless deposition of platinum on copper".

Company Profile

0.13.9

Kong; Bob - Newark CA
Kong; Bob - San Jose CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electroless deposition of platinum on copper Grant 9,023,137 - Kong , et al. May 5, 2	2015-05-05
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing Grant 8,859,427 - Kong , et al. October 14, 2	2014-10-14
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing Grant 8,728,879 - Kong , et al. May 20, 2	2014-05-20
Electroless Deposition of Platinum on Copper App 20130340648 - Kong; Bob ; et al.	2013-12-26
Methods for improving selectivity of electroless deposition processes Grant 8,551,560 - Tong , et al. October 8, 2	2013-10-08
Electroless deposition of platinum on copper Grant 8,545,998 - Kong , et al. October 1, 2	2013-10-01
Formation of A Zinc Passivation Layer on Titanium or Titanium Alloys Used in App 20120325109 - Kong; Bob ; et al.	2012-12-27
Formation Of A Zinc Passivation Layer On Titanium Or Titanium Alloys Used In Semiconductor Processing App 20120295436 - Kong; Bob ; et al.	2012-11-22
Noble metal activation layer Grant 8,278,215 - Sun , et al. October 2, 2	2012-10-02
Electroless Deposition of Platinum on Copper App 20120091590 - Kong; Bob ; et al.	2012-04-19
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing Grant 8,143,164 - Kong , et al. March 27, 2	2012-03-27
Noble Metal Activation Layer App 20110207320 - Sun; Zhi-Wen ; et al.	2011-08-25
Noble metal activation layer Grant 7,968,462 - Sun , et al. June 28, 2	2011-06-28
Formation of a Zinc Passivation Layer on Titanium or Titanium Alloys Used in Semiconductor Processing App 20100203731 - Kong; Bob ; et al.	2010-08-12
Electroless Deposition of Platinum on Copper App 20100055422 - Kong; Bob ; et al.	2010-03-04
Methods For Improving Selectivity of Electroless Deposition Processes App 20090291275 - Tong; Jinhong ; et al.	2009-11-26
Electroless plating solution and process Grant 6,797,312 - Kong , et al. September 28, 2	2004-09-28
Electroless plating solution and process App 20040142114 - Kong, Bob ; et al.	2004-07-22

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