loadpatents
name:-0.24445295333862
name:-0.026139974594116
name:-0.0092048645019531
KONDOH; Kouji Patent Filings

KONDOH; Kouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for KONDOH; Kouji.The latest application filed is for "semiconductor package, electronic device, and method for manufacturing semiconductor package".

Company Profile
4.9.17
  • KONDOH; Kouji - Kariya-city JP
  • KONDOH; Kouji - Kariya-shi JP
  • Kondoh; Kouji - Kariya JP
  • Kondoh; Kouji - Toyohashi JP
  • KONDOH; Kouji - Toyohashi-city JP
  • KONDOH; Kouji - Toyohashi-shi JP
  • Kondoh; Kouji - Toyota JP
  • Kondoh; Kouji - Tokoname JP
  • Kondoh; Kouji - Toyota-shi JP
  • Kondoh; Kouji - Tokoname-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package, Electronic Device, And Method For Manufacturing Semiconductor Package
App 20220115283 - YAMAGUCHI; Akihiro ;   et al.
2022-04-14
Flexible Laminated Board And Multilayer Circuit Board
App 20210153348 - TACHIBANA; Eisuke ;   et al.
2021-05-20
Radiant Heater Device
App 20190359032 - SAGOU; Yasuhiro ;   et al.
2019-11-28
Radiant heater
Grant 10,427,498 - Sagou , et al. October 1, 2
2019-10-01
Flexible Laminated Board And Multilayer Circuit Board
App 20170318670 - TACHIBANA; Eisuke ;   et al.
2017-11-02
Radiation heater apparatus
Grant 9,769,879 - Ota , et al. September 19, 2
2017-09-19
Radiant Heater
App 20170129310 - SAGOU; Yasuhiro ;   et al.
2017-05-11
Radiant Heater Device
App 20160059669 - SAGOU; Yasuhiro ;   et al.
2016-03-03
Multilayer Wiring Board
App 20160066415 - KATAOKA; Ryohei ;   et al.
2016-03-03
Radiation Heater Apparatus
App 20150110477 - Ota; Koji ;   et al.
2015-04-23
Multilayer board
Grant 8,963,017 - Masuda , et al. February 24, 2
2015-02-24
Electronic Device And Method Of Manufacturing The Same
App 20140118984 - FUJIHARA; Kohei ;   et al.
2014-05-01
Electrically Conductive Material And Electronic Device Using Same
App 20130114212 - Tada; Kazuo ;   et al.
2013-05-09
Circuit board with built-in semiconductor chip and method of manufacturing the same
Grant 8,390,106 - Maeda , et al. March 5, 2
2013-03-05
Multilayer Board
App 20130048345 - MASUDA; Gentaro ;   et al.
2013-02-28
Lock device for a vehicle
Grant 8,128,135 - Maeta , et al. March 6, 2
2012-03-06
Lock apparatus of seat for vehicle
Grant 8,118,342 - Kokubo , et al. February 21, 2
2012-02-21
Circuit Board With Built-in Semiconductor Chip And Method Of Manufacturing The Same
App 20110266666 - Maeda; Yukihiro ;   et al.
2011-11-03
Termination circuit, vehicle-mounted control apparatus, and vehicle-mounted communication system
Grant 7,804,188 - Sakai , et al. September 28, 2
2010-09-28
Method for filling conductive paste and method for manufacturing multilayer board
App 20100175806 - Shiraishi; Yoshihiko ;   et al.
2010-07-15
Lock Apparatus Of Seat For Vehicle
App 20090295186 - Kokubo; Motohiro ;   et al.
2009-12-03
Lock Device For A Vehicle
App 20090145183 - MAETA; Kenji ;   et al.
2009-06-11
Termination Circuit, Vehicle-mounted Control Apparatus, And Vehicle-mounted Communication System
App 20080204172 - SAKAI; Naoto ;   et al.
2008-08-28

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