loadpatents
Patent applications and USPTO patent grants for KONDOH; Kouji.The latest application filed is for "semiconductor package, electronic device, and method for manufacturing semiconductor package".
Patent | Date |
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Semiconductor Package, Electronic Device, And Method For Manufacturing Semiconductor Package App 20220115283 - YAMAGUCHI; Akihiro ;   et al. | 2022-04-14 |
Flexible Laminated Board And Multilayer Circuit Board App 20210153348 - TACHIBANA; Eisuke ;   et al. | 2021-05-20 |
Radiant Heater Device App 20190359032 - SAGOU; Yasuhiro ;   et al. | 2019-11-28 |
Radiant heater Grant 10,427,498 - Sagou , et al. October 1, 2 | 2019-10-01 |
Flexible Laminated Board And Multilayer Circuit Board App 20170318670 - TACHIBANA; Eisuke ;   et al. | 2017-11-02 |
Radiation heater apparatus Grant 9,769,879 - Ota , et al. September 19, 2 | 2017-09-19 |
Radiant Heater App 20170129310 - SAGOU; Yasuhiro ;   et al. | 2017-05-11 |
Radiant Heater Device App 20160059669 - SAGOU; Yasuhiro ;   et al. | 2016-03-03 |
Multilayer Wiring Board App 20160066415 - KATAOKA; Ryohei ;   et al. | 2016-03-03 |
Radiation Heater Apparatus App 20150110477 - Ota; Koji ;   et al. | 2015-04-23 |
Multilayer board Grant 8,963,017 - Masuda , et al. February 24, 2 | 2015-02-24 |
Electronic Device And Method Of Manufacturing The Same App 20140118984 - FUJIHARA; Kohei ;   et al. | 2014-05-01 |
Electrically Conductive Material And Electronic Device Using Same App 20130114212 - Tada; Kazuo ;   et al. | 2013-05-09 |
Circuit board with built-in semiconductor chip and method of manufacturing the same Grant 8,390,106 - Maeda , et al. March 5, 2 | 2013-03-05 |
Multilayer Board App 20130048345 - MASUDA; Gentaro ;   et al. | 2013-02-28 |
Lock device for a vehicle Grant 8,128,135 - Maeta , et al. March 6, 2 | 2012-03-06 |
Lock apparatus of seat for vehicle Grant 8,118,342 - Kokubo , et al. February 21, 2 | 2012-02-21 |
Circuit Board With Built-in Semiconductor Chip And Method Of Manufacturing The Same App 20110266666 - Maeda; Yukihiro ;   et al. | 2011-11-03 |
Termination circuit, vehicle-mounted control apparatus, and vehicle-mounted communication system Grant 7,804,188 - Sakai , et al. September 28, 2 | 2010-09-28 |
Method for filling conductive paste and method for manufacturing multilayer board App 20100175806 - Shiraishi; Yoshihiko ;   et al. | 2010-07-15 |
Lock Apparatus Of Seat For Vehicle App 20090295186 - Kokubo; Motohiro ;   et al. | 2009-12-03 |
Lock Device For A Vehicle App 20090145183 - MAETA; Kenji ;   et al. | 2009-06-11 |
Termination Circuit, Vehicle-mounted Control Apparatus, And Vehicle-mounted Communication System App 20080204172 - SAKAI; Naoto ;   et al. | 2008-08-28 |
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