KONDOH; Haruki
Patent Applications and Registrations
Patent applications and USPTO patent grants for KONDOH; Haruki.The latest application filed is for "method for manufacturing wiring board".
- KONDOH; Haruki - Okazaki-shi JP
- Kondoh; Haruki - Okazaki JP
- Kondoh; Haruki - Toyota-shi JP
| Patent | Date |
|---|---|
| Method For Manufacturing Wiring Board App 20220272847 - KONDOH; Haruki ; et al. | 2022-08-25 |
| Method for producing wiring substrate Grant 11,425,823 - Kondoh , et al. August 23, 2 | 2022-08-23 |
| Method for producing wiring substrate Grant 11,425,824 - Kuroda , et al. August 23, 2 | 2022-08-23 |
| Film Formation Apparatus And Film Formation Method For Forming Metal Film App 20220154362 - KATO; Akira ; et al. | 2022-05-19 |
| Film Formation Method For Metallic Coating And Film Formation Device For Metallic Coating App 20220098753 - KONDOH; Haruki ; et al. | 2022-03-31 |
| Film Formation Device And Film Formation Method For Metallic Coating App 20220081797 - Kato; Akira ; et al. | 2022-03-17 |
| Method For Manufacturing Wiring Board App 20220061165 - KURODA; Keiji ; et al. | 2022-02-24 |
| Method For Manufacturing Wiring Board, And Wiring Board App 20220007506 - KURODA; Keiji ; et al. | 2022-01-06 |
| Method For Producing Wiring Substrate App 20210410291 - KURODA; Keiji ; et al. | 2021-12-30 |
| Method For Producing Wiring Substrate App 20210392753 - KONDOH; Haruki ; et al. | 2021-12-16 |
| Method For Producing Wiring Substrate App 20210378103 - KONDOH; Haruki ; et al. | 2021-12-02 |
| Method For Manufacturing Wiring Board, And Wiring Board App 20210204409 - KONDOH; Haruki ; et al. | 2021-07-01 |
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