loadpatents
Patent applications and USPTO patent grants for Kondo; Yoshikimi.The latest application filed is for "polyamide composition and molded article".
Patent | Date |
---|---|
Polyamide composition and molded article Grant 11,192,979 - Ieda , et al. December 7, 2 | 2021-12-07 |
Polyamide Composition And Molded Article App 20200087458 - IEDA; Shinji ;   et al. | 2020-03-19 |
Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good Grant 7,927,514 - Kondo , et al. April 19, 2 | 2011-04-19 |
High-stability microencapsulated hardened for epoxy resin and epoxy resin composition Grant 7,854,860 - Kondo , et al. December 21, 2 | 2010-12-21 |
High-Stability Microencapsulated Hardened for Epoxy Resin and Epoxy Resin Composition App 20090261298 - Kondo; Yoshikimi ;   et al. | 2009-10-22 |
Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good App 20090186962 - Kondo; Yoshikimi ;   et al. | 2009-07-23 |
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