Kondo; Mitsuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kondo; Mitsuhiro.The latest application filed is for "switch device".
Company Profile
0.29.13
- Kondo; Mitsuhiro - Tsurugashima JP
- KONDO; Mitsuhiro - TSURUGASHIMA-SHI JP
- Kondo; Mitsuhiro - Nagano JP
- Kondo; Mitsuhiro - Ogaki JP
- Kondo; Mitsuhiro - Kamiina-gun JP
- Kondo; Mitsuhiro - Ogaki-shi JP
- Kondo; Mitsuhiro - late of Isehara JP
- Kondo; Mitsuhiro - Kosai JP
- Kondo; Mitsuhiro - Isehara JP
- Kondo; Mitsuhiro - Ohgaki JP
- Kondo; Mitsuhiro - Oogaki JP
- Kondo; Mitsuhiro - Gifu JP
Patent Activity
| Patent | Date |
|---|---|
| Switch device Grant 11,328,883 - Shimazu , et al. May 10, 2 | 2022-05-10 |
| Switch Device App 20210296065 - SHIMAZU; Yoshinobu ; et al. | 2021-09-23 |
| Switch Device App 20210296068 - SHIMAZU; Yoshinobu ; et al. | 2021-09-23 |
| Probe unit Grant 9,702,905 - Yamada , et al. July 11, 2 | 2017-07-11 |
| Probe Unit App 20140247065 - Yamada; Yoshio ; et al. | 2014-09-04 |
| Probe-unit base member and probe unit Grant 8,633,724 - Kazama , et al. January 21, 2 | 2014-01-21 |
| Conductive contact holder and conductive contact unit Grant 8,096,840 - Hironaka , et al. January 17, 2 | 2012-01-17 |
| Probe-unit Base Member And Probe Unit App 20110227596 - Kazama; Toshio ; et al. | 2011-09-22 |
| Method of manufacturing printed wiring board Grant 7,765,692 - Takada , et al. August 3, 2 | 2010-08-03 |
| Conductive Contact Holder And Conductive Contact Unit App 20100184306 - Hironaka; Kohei ; et al. | 2010-07-22 |
| Printed wiring board and method for manufacturing the same Grant 7,612,295 - Takada , et al. November 3, 2 | 2009-11-03 |
| Method of manufacturing printed wiring board Grant 7,594,320 - Takada , et al. September 29, 2 | 2009-09-29 |
| Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit Grant 7,552,531 - Takada , et al. June 30, 2 | 2009-06-30 |
| Printed Wiring Board And Method Of Manufacturing The Same App 20090019693 - Takada; Masaru ; et al. | 2009-01-22 |
| Printed wiring board and method for manufacturing the same Grant 7,339,118 - Takada , et al. March 4, 2 | 2008-03-04 |
| Printed Wiring Board and Method for Manufacturing The Same App 20060202344 - Takada; Masaru ; et al. | 2006-09-14 |
| Printed wiring board and method of manufacturing the same App 20060042824 - Takada; Masaru ; et al. | 2006-03-02 |
| Printed wiring board and method of manufacturing the same Grant 6,986,917 - Takada , et al. January 17, 2 | 2006-01-17 |
| Printed-circuit board and method of manufacture thereof Grant 6,809,415 - Tsukada , et al. October 26, 2 | 2004-10-26 |
| Printed wiring board and method of manufacturing the same App 20030203170 - Takada, Masaru ; et al. | 2003-10-30 |
| Printed wiring board and method of manufacturing the same App 20030150644 - Takada, Masaru ; et al. | 2003-08-14 |
| Printed wiring board having throughole and annular lands Grant 6,590,165 - Takada , et al. July 8, 2 | 2003-07-08 |
| Printed wiring board and method of manufacturing the same Grant 6,555,208 - Takada , et al. April 29, 2 | 2003-04-29 |
| Multilayer printed wiring board and method for manufacturing the same Grant 6,455,783 - Tsukada , et al. September 24, 2 | 2002-09-24 |
| Printed wiring board and method of manufacturing the same App 20010038905 - Takada, Masaru ; et al. | 2001-11-08 |
| Printed wiring board and method of manufacturing the same Grant 6,284,353 - Takada , et al. September 4, 2 | 2001-09-04 |
| Parts supply system Grant 6,275,743 - Kondo , et al. August 14, 2 | 2001-08-14 |
| Printed-circuit board and method of manufacture thereof App 20010002728 - Tsukada, Kiyotaka ; et al. | 2001-06-07 |
| Printed wiring board and method for manufacturing the same Grant 6,228,466 - Tsukada , et al. May 8, 2 | 2001-05-08 |
| Door member locking/unlocking apparatus Grant 5,938,252 - Uemura , et al. August 17, 1 | 1999-08-17 |
| Parts supply system Grant 5,692,867 - Kondo , et al. December 2, 1 | 1997-12-02 |
| Electronic component carriers and method of producing the same as well as electronic devices Grant 5,438,478 - Kondo , et al. August 1, 1 | 1995-08-01 |
| Encapsulated semiconductor device with bridge sealed lead frame Grant 5,285,104 - Kondo , et al. February 8, 1 | 1994-02-08 |
| Electronic-parts mounting board and electronic-parts mounting board frame Grant 5,252,784 - Asai , et al. October 12, 1 | 1993-10-12 |
| Method of manufacturing a high lead count circuit board Grant 5,206,188 - Hiroi , et al. April 27, 1 | 1993-04-27 |
| High lead count circuit board for connecting electronic components to an external circuit Grant 5,151,771 - Hiroi , et al. September 29, 1 | 1992-09-29 |
| Circuit board for mounting electronic components Grant 5,088,008 - Takeyama , et al. February 11, 1 | 1992-02-11 |
| Method of manufacturing circuit board for mounting electronic components Grant 5,022,960 - Takeyama , et al. June 11, 1 | 1991-06-11 |
| Method of manufacturing a substrate for mounting electronic components Grant 4,908,933 - Sagisaka , et al. March 20, 1 | 1990-03-20 |
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