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name:-0.064750909805298
name:-0.047350883483887
name:-0.013779878616333
KONDO; KAZUNORI Patent Filings

KONDO; KAZUNORI

Patent Applications and Registrations

Patent applications and USPTO patent grants for KONDO; KAZUNORI.The latest application filed is for "method for fabricating (led) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate".

Company Profile
12.49.54
  • KONDO; KAZUNORI - GUNMA JP
  • Kondo; Kazunori - Annaka JP
  • Kondo; Kazunori - Takasaki JP
  • Kondo; Kazunori - Annaka-shi JP
  • KONDO; Kazunori - Takasaki-shi JP
  • KONDO; Kazunori - Toyota-shi JP
  • KONDO; Kazunori - Kariya-shi JP
  • Kondo; Kazunori - Tokyo JP
  • Kondo; Kazunori - Toyota JP
  • Kondo; Kazunori - Hitachinaka JP
  • Kondo; Kazunori - Aichi-Ken JP
  • Kondo; Kazunori - Kamisu JP
  • KONDO; Kazunori - Kamisu-shi JP
  • Kondo; Kazunori - Ibaraki-ken JP
  • Kondo; Kazunori - Sagamihara JP
  • Kondo; Kazunori - Kashima-gun JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Fabricating (LED) Dice Using Semiconductor Structures On A Substrate And Laser Lift-Off To A Receiving Plate
App 20220271198 - Chu; Chen-Fu ;   et al.
2022-08-25
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
Grant 11,417,799 - Chu , et al. August 16, 2
2022-08-16
Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process
Grant 11,402,756 - Maruyama , et al. August 2, 2
2022-08-02
Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process
Grant 11,294,282 - Hayashi , et al. April 5, 2
2022-04-05
Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device
Grant 11,156,919 - Maruyama , et al. October 26, 2
2021-10-26
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
App 20210066541 - Chu; Chen-Fu ;   et al.
2021-03-04
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
Grant 10,850,482 - Ichioka , et al. December 1, 2
2020-12-01
Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer
Grant 10,796,939 - Tanabe , et al. October 6, 2
2020-10-06
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
Grant 10,730,273 - Ichioka , et al.
2020-08-04
Positive resist film laminate and pattern forming process
Grant 10,719,015 - Hirano , et al.
2020-07-21
Photosensitive Resin Composition And Photosensitive Dry Film
App 20200140678 - Ichioka; Yoichiro ;   et al.
2020-05-07
Silicone-modified polybenzoxazole resin and making method
Grant 10,538,630 - Maruyama , et al. Ja
2020-01-21
Chemically amplified positive resist film laminate and pattern forming process
Grant 10,514,601 - Hirano , et al. Dec
2019-12-24
Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process
Grant 10,503,067 - Maruyama , et al. Dec
2019-12-10
Photosensitive Resin Composition, Pattern Forming Process, And Fabrication Of Opto-semiconductor Device
App 20190354013 - Maruyama; Hitoshi ;   et al.
2019-11-21
Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process
Grant 10,451,970 - Maruyama , et al. Oc
2019-10-22
Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
Grant 10,428,239 - Kondo , et al. October 1, 2
2019-10-01
Surface protective film, making method, and substrate processing laminate
Grant 10,377,923 - Ichioka , et al. A
2019-08-13
Laminate and making method
Grant 10,373,903 - Yasuda , et al.
2019-08-06
Photosensitive Resin Composition, Pattern Forming Process, And Fabrication Of Opto-semiconductor Device
App 20190196331 - Maruyama; Hitoshi ;   et al.
2019-06-27
Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same
Grant 10,319,653 - Takemura , et al.
2019-06-11
Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
Grant 10,308,787 - Kondo , et al.
2019-06-04
Semiconductor device, making method, and laminate
Grant 10,297,485 - Yasuda , et al.
2019-05-21
Resin Composition, Resin Film, Semiconductor Laminate, Method For Manufacturing Semiconductor Laminate, And Method For Manufacturing Semiconductor Device
App 20190070836 - ICHIOKA; Yoichiro ;   et al.
2019-03-07
Resin Composition, Resin Film, Semiconductor Laminate, Method For Manufacturing Semiconductor Laminate, And Method For Manufacturing Semiconductor Device
App 20190070837 - ICHIOKA; Yoichiro ;   et al.
2019-03-07
Epoxy-containing, Isocyanurate-modified Silicone Resin, Photosensitive Resin Composition, Photosensitive Dry Film, Laminate, And Pattern Forming Process
App 20190064666 - Hayashi; Kumiko ;   et al.
2019-02-28
Silicone Structure-containing Polymer, Photosensitive Resin Composition, Photosensitive Resin Coating, Photosensitive Dry Film, Laminate, And Pattern Forming Process
App 20190049844 - Maruyama; Hitoshi ;   et al.
2019-02-14
Photosensitive Resin Composition, Photosensitive Resin Coating, Photosensitive Dry Film, Laminate, And Pattern Forming Process
App 20190049843 - Maruyama; Hitoshi ;   et al.
2019-02-14
Temporary Adhesive Film Roll For Substrate Processing, Method For Manufacturing Thin Wafer
App 20180350650 - TANABE; Masahito ;   et al.
2018-12-06
Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
Grant 10,141,272 - Takemura , et al. Nov
2018-11-27
Positive Resist Film Laminate And Pattern Forming Process
App 20180299774 - Hirano; Yoshinori ;   et al.
2018-10-18
Laminate And Making Method
App 20180277472 - Yasuda; Hiroyuki ;   et al.
2018-09-27
Semiconductor Device, Making Method, And Laminate
App 20180277415 - Yasuda; Hiroyuki ;   et al.
2018-09-27
Photosensitive Resin Composition, Photosensitive Dry Film, Photosensitive Resin Coating, And Pattern Forming Process
App 20180224743 - Maruyama; Hitoshi ;   et al.
2018-08-09
Silicone-modified Polybenzoxazole Resin And Making Method
App 20180223049 - Maruyama; Hitoshi ;   et al.
2018-08-09
Flame retardant resin composition, flame retardant resin film, semiconductor device, and making method
Grant 10,035,912 - Kondo , et al. July 31, 2
2018-07-31
Resin composition, resin film, semiconductor device and method of manufacture thereof
Grant 10,026,650 - Kondo , et al. July 17, 2
2018-07-17
Chemically Amplified Positive Resist Film Laminate And Pattern Forming Process
App 20180143535 - Hirano; Yoshinori ;   et al.
2018-05-24
Film-like wafer mold material, molded wafer, and semiconductor device
Grant 9,929,068 - Sugo , et al. March 27, 2
2018-03-27
Resin composition, resin film, and semiconductor device and method for manufacturing same
Grant 9,890,254 - Kondo , et al. February 13, 2
2018-02-13
Silicone Skeleton-containing Polymer, Photo-curable Resin Composition, Photo-curable Dry Film, Laminate, And Patterning Process
App 20180004088 - MARUYAMA; Hitoshi ;   et al.
2018-01-04
Resin Composition, Resin Film, Method For Producing Resin Film, Method For Producing Semiconductor Device, And Semiconductor Device
App 20170313904 - KONDO; Kazunori ;   et al.
2017-11-02
Resin Composition, Resin Film, Method For Producing Resin Film, Method For Producing Semiconductor Device, And Semiconductor Device
App 20170283581 - KONDO; Kazunori ;   et al.
2017-10-05
Surface Protective Film, Making Method, And Substrate Processing Laminate
App 20170226386 - Ichioka; Yoichiro ;   et al.
2017-08-10
Sliding Member And Manufacturing Method Therefor
App 20170209932 - KURONO; Takahiro ;   et al.
2017-07-27
Flame Retardant Resin Composition, Flame Retardant Resin Film, Semiconductor Device, And Making Method
App 20170121526 - Kondo; Kazunori ;   et al.
2017-05-04
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same
App 20170103932 - TAKEMURA; Katsuya ;   et al.
2017-04-13
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same
App 20170077043 - TAKEMURA; Katsuya ;   et al.
2017-03-16
Resin Composition, Resin Film, And Semiconductor Device And Method For Manufacturing Same
App 20170009022 - KONDO; Kazunori ;   et al.
2017-01-12
Resin Composition, Resin Film, Semiconductor Device And Method Of Manufacture Thereof
App 20160315025 - Kondo; Kazunori ;   et al.
2016-10-27
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
Grant 9,472,438 - Kondo , et al. October 18, 2
2016-10-18
Silicone resin, resin composition, resin film, semiconductor device, and making method
Grant 9,447,305 - Kondo , et al. September 20, 2
2016-09-20
Silicone Resin, Resin Composition, Resin Film, Semiconductor Device, And Making Method
App 20160122586 - KONDO; Kazunori ;   et al.
2016-05-05
Shock Absorber
App 20160010716 - KEIDA; Tatsuya ;   et al.
2016-01-14
Resin composition, resin film, semiconductor device, and production method thereof
Grant 8,883,913 - Kondo , et al. November 11, 2
2014-11-11
Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the same
Grant 8,808,865 - Kondo August 19, 2
2014-08-19
Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
Grant 8,796,410 - Sugo , et al. August 5, 2
2014-08-05
Wafer Processing Laminate, Wafer Processing Member, Temporary Adhering Material For Processing Wafer, And Manufacturing Method Of Thin Wafer
App 20140106137 - KONDO; Kazunori ;   et al.
2014-04-17
Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition
Grant 8,673,537 - Furuya , et al. March 18, 2
2014-03-18
Wheel for vehicle
Grant 8,596,726 - Kondo , et al. December 3, 2
2013-12-03
Adhesive Composition, And Adhesive Sheet, Semiconductor Apparatus-protective Material And Semiconductor Apparatus Using The Same
App 20130289225 - KONDO; Kazunori
2013-10-31
Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
Grant 8,501,879 - Kondo , et al. August 6, 2
2013-08-06
Method for manufacturing lamination type semiconductor integrated device
Grant 8,466,041 - Kuroda , et al. June 18, 2
2013-06-18
Wheel For Vehicle
App 20130119749 - Kondo; Kazunori ;   et al.
2013-05-16
Resin Composition, Resin Film, Semiconductor Device, And Production Method Thereof
App 20130113083 - KONDO; Kazunori ;   et al.
2013-05-09
Frame molding
Grant 8,408,622 - Yanai , et al. April 2, 2
2013-04-02
Polymer Having Silphenylene And Siloxane Structures, A Method Of Preparing The Same, An Adhesive Composition, An Adhesive Sheet, A Protective Material For A Semiconductor Device, And A Semiconductor Device
App 20120299203 - SUGO; Michihiro ;   et al.
2012-11-29
High pressure fuel pump control apparatus for internal combustion engine
Grant 8,315,780 - Toyohara , et al. November 20, 2
2012-11-20
Film-like Wafer Mold Material, Molded Wafer, And Semiconductor Device
App 20120235284 - SUGO; Michihiro ;   et al.
2012-09-20
Sliding Member And Manufacturing Method Therefor
App 20120231289 - Kurono; Takahiro ;   et al.
2012-09-13
Joint structure of door edge member
Grant 8,226,143 - Takeuchi , et al. July 24, 2
2012-07-24
Wafer Mold Material And Method For Manufacturing Semiconductor Apparatus
App 20120139131 - SUGO; Michihiro ;   et al.
2012-06-07
Adhesive Composition, Adhesive Sheet, Semiconductor Apparatus Protection Material, And Semiconductor Apparatus
App 20120108762 - KONDO; Kazunori ;   et al.
2012-05-03
Frame Molding
App 20110187141 - Yanai; Toshifumi ;   et al.
2011-08-04
Photo-curable Resin Composition, Pattern Forming Method And Substrate Protecting Film, And Film-shaped Adhesive And Adhesive Sheet Using Said Composition
App 20110143103 - Furuya; Masahiro ;   et al.
2011-06-16
Method For Manufacturing Lamination Type Semiconductor Integrated Device
App 20110136321 - KURODA; Yasuyoshi ;   et al.
2011-06-09
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Grant 7,820,740 - Kondo , et al. October 26, 2
2010-10-26
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Grant 7,820,741 - Kondo , et al. October 26, 2
2010-10-26
Joint Structure Of Door Edge Member
App 20100181798 - Takeuchi; Katsuhiko ;   et al.
2010-07-22
High Pressure Fuel Pump Control Apparatus For Internal Combustion Engine
App 20100082223 - TOYOHARA; Masahiro ;   et al.
2010-04-01
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Grant 7,524,563 - Nakanishi , et al. April 28, 2
2009-04-28
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
Grant 7,524,394 - Nakanishi , et al. April 28, 2
2009-04-28
Flame Retardant Adhesive Composition, And Adhesive Sheet, Coverlay Film And Flexible Copper-clad Laminate Using Same
App 20080241452 - KONDO; Kazunori ;   et al.
2008-10-02
Flame Retardant Adhesive Composition, And Adhesive Sheet, Coverlay Film And Flexible Copper-clad Laminate Using Same
App 20080090075 - Kondo; Kazunori ;   et al.
2008-04-17
Acrylic adhesive sheet
Grant 7,348,057 - Kondo , et al. March 25, 2
2008-03-25
Oil Cleaning Sheets For Makeup
App 20070087040 - Kondo; Kazunori ;   et al.
2007-04-19
Oil cleaning sheets for makeup
Grant 7,157,093 - Kondo , et al. January 2, 2
2007-01-02
Flame Retardant Adhesive Composition, And Adhesive Sheet, Coverlay Film And Flexible Copper-clad Laminate Using Same
App 20060264538 - NAKANISHI; Toru ;   et al.
2006-11-23
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
App 20060234044 - Nakanishi; Toru ;   et al.
2006-10-19
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
App 20060234045 - Nakanishi; Toru ;   et al.
2006-10-19
Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
App 20060234043 - Nakanishi; Toru ;   et al.
2006-10-19
Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheet
App 20060069201 - Kondo; Kazunori ;   et al.
2006-03-30
Acrylic adhesive composition and acrylic adhesive sheet
App 20060069200 - Kondo; Kazunori ;   et al.
2006-03-30
Acrylic adhesive sheet
App 20050101734 - Kondo, Kazunori ;   et al.
2005-05-12
Liquid radiation-curable resin composition, optical fiber coating composition, and optical fiber
Grant 6,602,929 - Ohba , et al. August 5, 2
2003-08-05

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