Kondo; Ichiharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kondo; Ichiharu.The latest application filed is for "semiconductor device having aluminum electrode and metallic electrode".

Company Profile

0.8.6

Kondo; Ichiharu - Aichi-ken JP
Kondo; Ichiharu - Nagoya JP
Kondo; Ichiharu - Nagoya-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Compact pressure sensor with high corrosion resistance and high accuracy Grant 7,242,065 - Kondo , et al. July 10, 2	2007-07-10
Pressure sensor Grant 7,176,541 - Tanaka , et al. February 13, 2	2007-02-13
Compact pressure sensor with high corrosion resistance and high accuracy Grant 7,168,326 - Toyoda , et al. January 30, 2	2007-01-30
Semiconductor device having aluminum electrode and metallic electrode App 20060081996 - Shinyama; Keiji ; et al.	2006-04-20
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same Grant 7,030,496 - Shinyama , et al. April 18, 2	2006-04-18
Pressure sensor App 20050269654 - Tanaka, Hiroaki ; et al.	2005-12-08
Compact pressure sensor with high corrosion resistance and high accuracy App 20050210993 - Toyoda, Inao ; et al.	2005-09-29
Compact pressure sensor with high corrosion resistance and high accuracy App 20050205950 - Kondo, Ichiharu ; et al.	2005-09-22
Semiconductor sensor and method of plating semiconductor devices App 20050034526 - Shinyama, Keiji ; et al.	2005-02-17
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same App 20050006778 - Shinyama, Keiji ; et al.	2005-01-13
Method for forming and patterning film Grant 6,548,386 - Kondo , et al. April 15, 2	2003-04-15
Sputter-deposited nickel layer Grant 5,876,861 - Kondo , et al. March 2, 1	1999-03-02
Semiconductor device with bump structure Grant 5,656,858 - Kondo , et al. August 12, 1	1997-08-12
Surface treated structure for solder joint Grant 5,635,764 - Fujikawa , et al. June 3, 1	1997-06-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.